| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Requires | Package / Case | Polarization | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S150TS-FC1152 | Microsemi | IC FPGA SOC 150K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 1152-BBGA, FCBGA | - | - | |
| XCZU5CG-2FBVB900E | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | Tray | - | - | - | 900-BBGA, FCBGA | - | - | |
| 5ASXBB5D4F40C4N | Intel® FPGAs | IC FPGA 528 I/O 1517FBGA | Arria V SX | 0°C ~ 85°C (TJ) | Tray | - | - | - | 1517-BBGA | - | 5ASXBB5 | |
| XCZU9CG-L2FFVC900E | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | Tray | - | - | - | 900-BBGA, FCBGA | - | - | |
| M2S050T-1FCS325 | Microsemi | IC FPGA SOC 50K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 325-TFBGA | - | - | |
| M2S025T-FGG484I | Microsemi | IC FPGA SOC 25K LUT 484FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 484-BGA | - | - | |
| 10AS032E2F27E2SG | Intel® FPGAs | 672-PIN FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | Tray | - | - | - | - | - | - | |
| 5CSEBA6U19C8NES | Altera (Intel® Programmable Solutions Group) | IC FPGA 66 I/O 484UBGA | Cyclone® V SE | 0°C ~ 85°C (TJ) | Tray | - | - | - | 484-FBGA | - | 5CSEBA6 | |
| M2S050-1FGG896 | Microsemi | IC FPGA SOC 50K LUTS 896FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 896-FBGA | - | M2S050 | |
| M2S050-FCS325 | Microsemi | IC FPGA SOC 50K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 325-TFBGA | - | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.