• info@zenkaeurope.com
  • English
    English
    Deutsch
    Français
    Español
    Italiano
    中文
    हिन्दी
    Lietuviškai

Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
Manufacturer
Series
Operating Temperature
Packaging
Package / Case
Base Part Number
Supplier Device Package

Clear Filters

Loading products…

Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XCZU17EG-3FFVB1517E Xilinx IC FPGA 644 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
XCZU5EV-3SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
XCZU7CG-L1FFVC1156I Xilinx IC FPGA 360 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
XC7Z030-1FFG676I Xilinx IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA XC7Z030 676-FCBGA (27x27) -
M2S090T-FCS325 Microsemi IC FPGA SOC 90K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
M2S150-FC1152I Microsemi IC FPGA SOC 150K LUTS 1152FCBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
1SX250LN3F43I2VG Intel® FPGAs 1760-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
5CSXFC5D6F31C8N Altera (Intel® Programmable Solutions Group) IC FPGA 288 I/O 896FBGA Cyclone® V SX 0°C ~ 85°C (TJ) - Tray - 896-BGA 5CSXFC5 896-FBGA (31x31) -
10AS066H1F34I1HG Intel® FPGAs IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
1SX250LH3F55E1VG Intel® FPGAs 2912-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.