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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Voltage - Supply | Shell Style |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MAX15096GWE+T | Maxim Integrated | 2.7V TO 18V, 6A INTEGRATED HOT-S | - | - | Tape & Reel (TR) | Surface Mount | - | - | - | - | - | |
| SIS5102QP1HT1G | AMI Semiconductor / ON Semiconductor | IC SMART HOTPLUG HI SIDE 12PLLP | - | - | Tape & Reel (TR) | - | - | - | - | - | - | |
| LT1640LCN8#PBF | ADI (Analog Devices, Inc.) | IC CONTRLR HOTSWAP NEGVOLT 8-DIP | - | 0°C ~ 70°C | Tube | Through Hole | - | - | Hot Swap Controller | -80 V ~ -10 V | - | |
| MAX5902LCETT+ | Maxim Integrated | IC SUPERVISOR | - | - | - | - | - | - | - | - | - | |
| TPS24712DGS | N/A | IC CTRLR HOT SWAP 2.5-18V 10MSOP | - | -40°C ~ 85°C | Bulk | Surface Mount | - | - | Hot Swap Controller | 2.5 V ~ 18 V | - | |
| MAX5933EESA+ | Maxim Integrated | IC HOT-SWAP CONTROLLER 8-SOIC | - | -40°C ~ 85°C | Tube | Surface Mount | - | - | Hot Swap Controller | 33 V ~ 80 V | - | |
| TPS24771RGET | N/A | IC CTRLR HOT SWAP 2.5-18V 24VQFN | - | -40°C ~ 125°C | Original-Reel® | Surface Mount | - | - | Hot Swap Controller | 2.5 V ~ 18 V | - | |
| MAX15091ETI+ | Maxim Integrated | IC CTRLR HOTSWAP 2.7V-18V 28TQFN | - | -40°C ~ 85°C | Tube | Surface Mount | - | - | Hot Swap Controller | 2.7 V ~ 18 V | - | |
| UCC3918DP | N/A | IC HOT SWAP POWER MANAGER 16SOIC | - | 0°C ~ 70°C | Tube | Surface Mount | - | - | Hot Swap Controller | 3 V ~ 6 V | - | |
| LT1641IS8#TRPBF | ADI (Analog Devices, Inc.) | IC CONTRLR HOTSWAP POSVOLT 8SOIC | - | -40°C ~ 85°C | Tape & Reel (TR) | Surface Mount | - | - | Hot Swap Controller | 9 V ~ 80 V | - |
PMIC hot swap controllers facilitate safe insertion and removal of electronic components, such as power supplies, into live systems without causing disruptions or damage. These controllers offer features like current limiting, voltage monitoring, and inrush current control to protect sensitive components and ensure smooth system operation during hot swap events.