Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

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Image Part Number Manufacturer Description Series Operating Temperature Packaging RoHS Status Manufacturer Part Number Requires Package / Case Polarization Base Part Number
M2S150TS-1FC1152M Microsemi IC FPGA SOC 150K LUTS 1152FCBGA SmartFusion®2 -55°C ~ 125°C (TJ) Tray - - - 1152-BBGA, FCBGA - -
M2S090T-FGG676I Microsemi IC FPGA SOC 90K LUTS 676FBGA SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 676-BGA - -
5ASXMB5E4F31I3N Intel® FPGAs IC FPGA 170 I/O 896FBGA Arria V SX -40°C ~ 100°C (TJ) Tray - - - 896-BBGA, FCBGA - 5ASXMB5
XCZU4EV-L1SFVC784I Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC EV -40°C ~ 100°C (TJ) Tray - - - 784-BBGA, FCBGA - -
XCZU19EG-2FFVE1924I Xilinx IC FPGA 668 I/O 1924FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) Tray - - - 1924-BBGA, FCBGA - -
M2S150T-FCG1152I Microsemi IC FPGA SOC 150K LUTS 1152FCBGA SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 1152-BBGA, FCBGA - -
10AS057K1F40I1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) Tray - - - 1517-BBGA, FCBGA - -
XCZU5EG-L1SFVC784I Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) Tray - - - 784-BBGA, FCBGA - -
10AS048E3F29E2LG Intel® FPGAs 780-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) Tray - - - - - -
M2S050TS-1FG896I Microsemi IC FPGA SOC 50K LUTS 896FBGA SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 896-FBGA - M2S050TS

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.