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Embedded - System On Chip (SoC)
Embedded - System On Chip (SoC)
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- Integrated Circuits (ICs)
- Embedded - System On Chip (SoC)
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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5CSXFC6C6U23I7NTS | Intel® FPGAs | 672-PIN UBGA | - | - | - | Tray | - | - | - | - | - |
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XC7Z100-L2FFG1156I | 4D Systems | IC SOC CORTEX-A9 KINTEX7 1156BGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - |
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BCM33843GUKFSBG | Avago Technologies (Broadcom Limited) | CABLE MODEM | - | - | - | - | - | - | - | - | - |
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BCM3384EUKFSBG | Avago Technologies (Broadcom Limited) | CABLE MODEM | - | - | - | - | - | - | - | - | - |
|
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5CSXFC5C6U23I7LN | Intel® FPGAs | 672-PIN UBGA | - | - | - | Tray | - | - | - | - | - |
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XAZU3EG-L1SFVC784I | Xilinx | XAZU3EG-L1SFVC784I | - | - | - | Tray | - | - | - | - | - |
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1SX280LU3F50I2VG | Intel® FPGAs | 2397-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
|
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1SX280LN3F43E3VG | Intel® FPGAs | 1760-PIN FBGA | Stratix® 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
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XC7Z035-1FFG900C | Xilinx | IC SOC CORTEX-A9 KINTEX7 900BGA | Zynq®-7000 | 0°C ~ 85°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - |
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1SX280LH2F55I2LG | Intel® FPGAs | 2912-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
About Embedded - System On Chip (SoC)
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.