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    Embedded - System On Chip (SoC)

    Embedded - System On Chip (SoC)

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    Image Part Number Manufacturer Description Series Operating Temperature Packaging RoHS Status Manufacturer Part Number Requires Package / Case Polarization Base Part Number
    Manufacturer Image
    		M2S005S-VFG256I Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 256-LBGA - -
    Manufacturer Image
    		M2S010T-VF400 Microsemi IC FPGA SOC 10K LUTS 400VFBGA SmartFusion®2 0°C ~ 85°C (TJ) Tray - - - 400-LFBGA - M2S010T
    Manufacturer Image
    		5ASXBB5D4F40C5N Intel® FPGAs IC FPGA 528 I/O 1517FBGA Arria V SX 0°C ~ 85°C (TJ) Tray - - - 1517-BBGA - 5ASXBB5
    Product Image
    		5ASXMB3E4F31I5N Intel® FPGAs IC FPGA 170 I/O 896FBGA Arria V SX -40°C ~ 100°C (TJ) Tray - - - 896-BBGA, FCBGA - 5ASXMB3
    Manufacturer Image
    		5CSEBA2U19C8SN Intel® FPGAs IC FPGA 161 I/O 484FBGA Cyclone® V SE 0°C ~ 85°C (TJ) Tray - - - 484-FBGA - -
    Product Image
    		10AS057H2F34E1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) Tray - - - 1152-BBGA, FCBGA - -
    Manufacturer Image
    		10AS022C4U19E3SG Intel® FPGAs 484-PIN UBGA Arria 10 SX 0°C ~ 100°C (TJ) Tray - - - - - -
    Manufacturer Image
    		M2S050-VFG400 Microsemi IC FPGA SOC 50K LUTS 400VFBGA SmartFusion®2 0°C ~ 85°C (TJ) Tray - - - 400-LFBGA - M2S050
    Manufacturer Image
    		XCZU2EG-3SBVA484E Xilinx IC FPGA 82 I/O 484FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) Tray - - - 484-BBGA, FCBGA - -
    Manufacturer Image
    		M2S060-FG484 Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 0°C ~ 85°C (TJ) Tray - - - 484-BGA - -

    About Embedded - System On Chip (SoC)

    A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.