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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S060TS-1VFG400T2 | Microsemi | IC FPGA SOC | Automotive, AEC-Q100, SmartFusion®2 | -40°C ~ 125°C (TJ) | - | Tray | - | 400-LFBGA | - | 400-VFBGA (17x17) | - | |
| XCZU19EG-2FFVD1760E | Xilinx | IC FPGA 308 I/O 1760FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 1760-BBGA, FCBGA | - | 1760-FCBGA (42.5x42.5) | - | |
| M2S100T-1FC1152I | Microsemi | IC FPGA SOC 100K LUTS 1152FCBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | M2S100T | 1152-FCBGA (35x35) | - | |
| M2S025TS-FCS325I | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 325-TFBGA | - | 325-BGA (11x11) | - | |
| XCZU2CG-2SBVA484E | Xilinx | IC FPGA 82 I/O 484FCBGA | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | - | Tray | - | 484-BBGA, FCBGA | - | 484-FCBGA (19x19) | - | |
| XC7Z100-2FF900I | Xilinx | XC7Z100-2FF900I | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| 5CSEMA5F31A7N | Intel® FPGAs | IC FPGA 288 I/O 896FBGA | Automotive, AEC-Q100, Cyclone® V SE | -40°C ~ 125°C (TJ) | - | Tray | - | 896-BGA | 5CSEMA5 | 896-FBGA (31x31) | - | |
| 10AS066N3F40I2LG | Intel® FPGAs | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - | |
| M2S010-VF400I | Microsemi | IC FPGA SOC 10K LUTS 400VFBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 400-LFBGA | - | 400-VFBGA (17x17) | - | |
| XCZU7EG-L1FFVF1517I | Xilinx | IC FPGA 464 I/O 1517FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | - | 1517-FCBGA (40x40) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.