| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | RoHS Status | Type | Length | Shape | Material | Width | Plating - Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 4795PA51H09600 | Laird Technologies | GK,NICU,PTAFG,PU,V0,REC | - | - | - | Fabric Over Foam | 96.000" (243.84cm) | Rectangle | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | 0.500" (12.70mm) | - | |
| 8863-0100-50 | Laird Technologies | OSTRSD,ECE050 1.0MM | - | - | RoHS Compliant | - | - | - | - | - | - | |
| 4619PA51H01800 | Laird Technologies | GASKT FABRIC/FOAM 5X457.2MM RECT | - | - | - | Fabric Over Foam | 18.000" (457.20mm) | Rectangle | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | 0.197" (5.00mm) | - | |
| 11-32AH-SN-17.76 | Leader Tech Inc. | 0.11 X 0.32 SN 17.76--11-32AH-SN | - | -55°C ~ 121°C | - | Fingerstock | 17.760" (451.10mm) | - | Beryllium Copper | 0.320" (8.13mm) | Flash | |
| 4096PA51G01800 | Laird Technologies | GASKT FABRIC/FOAM 7X457.2MM RECT | - | - | - | Fabric Over Foam | 18.000" (457.20mm) | Rectangle | - | 0.276" (7.00mm) | - | |
| 0097036021 | Laird Technologies | CSTR,STR,SU | Foldover | 121°C | - | Fingerstock | - | - | Beryllium Copper | - | - | |
| S1741-46R | Harwin | RFI SHIELD FINGER TIN 2.5MM SMD | EZ BoardWare | -55°C ~ 125°C | - | Shield Clip | 0.213" (5.40mm) | - | Stainless Steel | 0.122" (3.10mm) | 157.48µin (4.00µm) | |
| 0C78001002 | Laird Technologies | GASKET ULTRASOFT 8.1MMX7.6M | Slot Mount | 121°C | - | Fingerstock | 16.000" (406.40mm) | - | Beryllium Copper | 0.320" (8.13mm) | - | |
| 0078005615 | Laird Technologies | VSLMT,STR,ZNC,USFT | - | 121°C | - | Fingerstock | 16.000" (406.40mm) | - | Beryllium Copper | 0.320" (8.13mm) | 299.21µin (7.60µm) | |
| 4202AE51H01800 | Laird Technologies | GK NICU PTAFG PU V0 DSH | - | - | - | Fabric Over Foam | 18.000" (457.20mm) | D-Shape | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | 0.252" (6.40mm) | - |
RFI (Radio-Frequency Interference) and EMI (Electromagnetic Interference) contacts, fingerstock, and gaskets are components used to provide electromagnetic shielding and grounding in electronic enclosures and systems. They help prevent the ingress and egress of unwanted electromagnetic radiation, minimizing interference and noise that can affect the performance of sensitive electronic circuits. RFI and EMI shielding components include conductive contacts, fingerstock strips, gaskets, and shielding materials made from materials such as conductive elastomers, metal alloys, and conductive foams. They are essential for maintaining electromagnetic compatibility (EMC) and ensuring compliance with regulatory standards in electronic products and systems.