Contacts - Leadframe

Contacts - Leadframe

Manufacturer
Series
Features
Packaging
Contact Material
Contact Finish
Pitch
Termination
Board Thickness
Pin Length

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Image Part Number Manufacturer Description Series Features Packaging Contact Material Contact Finish Pitch Termination Board Thickness Pin Length
1544407-4 Agastat Relays / TE Connectivity CONTACT A SOUDER - - Reel Phosphor Bronze Tin 0.100" (2.54mm) Through Hole - 0.276" (7.00mm)
1544407-3 Agastat Relays / TE Connectivity CONTACT A SOUDER - - Reel Phosphor Bronze Tin 0.100" (2.54mm) Through Hole - 0.276" (7.00mm)
1544172-1 Agastat Relays / TE Connectivity CTS 1505 ETAME PRONER - Reel Phosphor Bronze Tin 0.100" (2.54mm) Through Hole - 0.358" (9.10mm)
1544207-1 Agastat Relays / TE Connectivity CONTACT A SOUDER - - Reel - Tin 0.100" (2.54mm) Through Hole - 0.339" (8.60mm)
1544146-3 Agastat Relays / TE Connectivity CONTACTS DIL DOUBL - - Reel Phosphor Bronze Tin 0.100" (2.54mm) Through Hole 0.025" (0.64mm) 0.331" (8.40mm)
1544426-2 Agastat Relays / TE Connectivity CTS 1,27 BRONZE ET - - Reel Phosphor Bronze Tin 0.050" (1.27mm) Through Hole 0.025" (0.64mm) 0.382" (9.70mm)
1544174-1 Agastat Relays / TE Connectivity CTS 1511 PRE-ETAME - - Reel - Tin 0.100" (2.54mm) Through Hole - 0.260" (6.60mm)
1544169-2 Agastat Relays / TE Connectivity CONTACTS DIL DOUBL - - Reel Phosphor Bronze Tin 0.100" (2.54mm) Through Hole 0.039" (1.00mm) 0.331" (8.40mm)
1544443-1 Agastat Relays / TE Connectivity CT DOUBLE INS G - - Reel Phosphor Bronze Tin 0.100" (2.54mm) Through Hole 0.039" (1.00mm) 0.358" (9.10mm)
1544242-1 Agastat Relays / TE Connectivity CTS SIL 2487 PRE-E - - Tape & Reel (TR) Phosphor Bronze Tin 0.100" (2.54mm) Through Hole 0.045" (1.14mm) 0.374" (9.50mm)

About Contacts - Leadframe


Leadframe contacts are components in the electronics industry designed to facilitate the connection between integrated circuits (ICs) and external devices or systems. These contacts are often part of the leadframe, a metal structure that supports and connects the IC during the manufacturing process. Leadframe contacts ensure reliable electrical connections between the IC and the external environment, contributing to the functionality and performance of electronic devices such as semiconductor packages and integrated circuits. The design and quality of leadframe contacts are critical in achieving optimal signal transmission and overall reliability in electronic systems.