| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 20-101-1321 | Digi International | MODULE MINICORE RCM6760 | MiniCore® | -40°C ~ 85°C | - | 1.2" x 2" (30mm x 51mm) | MPU Core | - | Rabbit 6000 | Edge Connector - 52 | - | |
| 100-1470-2 | Bluetechnix GmbH | MODULE I.MX53 1GB DDR2 | i.MX | -40°C ~ 85°C | - | 3.15" x 1.77" (80mm x 45 mm) | MPU Core | - | CM-i.MX53 | Expansion 3 x 100 | - | |
| 3358-IX-X38-RI | Critical Link | MITYSOM-3358 W/ AM3358 | MitySOM | -40°C ~ 85°C | - | 2.66" x 1.5" (67.6mm x 38.1mm) | MPU Core | - | ARM® Cortex®-A8, AM3358 | SO-DIMM-204 | - | |
| DC-ME-Y413-LX-B | Digi International | ME 9210 16MB SDRAM 8MB FLASH | Digi Connect ME® | -40°C ~ 80°C | - | 1.45" x 0.75" (36.7mm x 19.1mm) | MPU Core | - | ARM926EJ-S, NS9210 | RJ45 | - | |
| MOD5272-100CR | NetBurner, Inc. | PROCESSOR MODULE FLASH | - | 0°C ~ 70°C | - | 2.6" x 2" (66.04mm x 50.8mm) | MCU, Ethernet Core | - | ColdFire 5272 | RJ-45, 2x50 Header | - | |
| FS-362 | Digi International | MODULE A9M2410 32MB SDRAM FLASH | - | - | - | - | - | - | - | - | - | |
| CENGLH7A400-10-402HC | Logic PD, Inc. | CARD ENGINE 32MB SDRAM | - | 0°C ~ 70°C | - | 2.37" x 2.67" (60.2mm x 67.8mm) | MPU Core | - | ARM922T, LH7A400 | SO-DIMM-144 | - | |
| SOMAM3517-10-1780FJCR | Logic PD, Inc. | IC SOM AM3517 MODULE | AM35x | 0°C ~ 70°C | - | 1.61" x 2.02" (40.9mm x 51.2mm) | MPU Core | - | ARM® Cortex®-A8, AM3517 | Board-to-Board (BTB) Socket - 300 | - | |
| CC-MX-MB6B-SLB-1 | Digi International | CONNECTCORE | - | - | - | - | - | - | - | - | - | |
| DOH5210C | DAVE Embedded Systems | SYSTEM ON MODULE DM8148 2GB DDR3 | DIDO | - | - | - | MPU, DSP Core | - | ARM® Cortex®-A8, DM8148 | 2 x 140 Pins 0.6mm Pitch | - |
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.