Embedded - Microcontroller, Microprocessor, FPGA Modules

Embedded - Microcontroller, Microprocessor, FPGA Modules

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Operating Temperature
Manufacturer Part Number
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Module/Board Type
Operating System
Core Processor
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Image Part Number Manufacturer Description Series Operating Temperature Manufacturer Part Number Size / Dimension Module/Board Type Operating System Core Processor Connector Type Reverse Recovery Time (trr)
20-101-1321 Digi International MODULE MINICORE RCM6760 MiniCore® -40°C ~ 85°C - 1.2" x 2" (30mm x 51mm) MPU Core - Rabbit 6000 Edge Connector - 52 -
100-1470-2 Bluetechnix GmbH MODULE I.MX53 1GB DDR2 i.MX -40°C ~ 85°C - 3.15" x 1.77" (80mm x 45 mm) MPU Core - CM-i.MX53 Expansion 3 x 100 -
3358-IX-X38-RI Critical Link MITYSOM-3358 W/ AM3358 MitySOM -40°C ~ 85°C - 2.66" x 1.5" (67.6mm x 38.1mm) MPU Core - ARM® Cortex®-A8, AM3358 SO-DIMM-204 -
DC-ME-Y413-LX-B Digi International ME 9210 16MB SDRAM 8MB FLASH Digi Connect ME® -40°C ~ 80°C - 1.45" x 0.75" (36.7mm x 19.1mm) MPU Core - ARM926EJ-S, NS9210 RJ45 -
MOD5272-100CR NetBurner, Inc. PROCESSOR MODULE FLASH - 0°C ~ 70°C - 2.6" x 2" (66.04mm x 50.8mm) MCU, Ethernet Core - ColdFire 5272 RJ-45, 2x50 Header -
FS-362 Digi International MODULE A9M2410 32MB SDRAM FLASH - - - - - - - - -
CENGLH7A400-10-402HC Logic PD, Inc. CARD ENGINE 32MB SDRAM - 0°C ~ 70°C - 2.37" x 2.67" (60.2mm x 67.8mm) MPU Core - ARM922T, LH7A400 SO-DIMM-144 -
SOMAM3517-10-1780FJCR Logic PD, Inc. IC SOM AM3517 MODULE AM35x 0°C ~ 70°C - 1.61" x 2.02" (40.9mm x 51.2mm) MPU Core - ARM® Cortex®-A8, AM3517 Board-to-Board (BTB) Socket - 300 -
CC-MX-MB6B-SLB-1 Digi International CONNECTCORE - - - - - - - - -
DOH5210C DAVE Embedded Systems SYSTEM ON MODULE DM8148 2GB DDR3 DIDO - - - MPU, DSP Core - ARM® Cortex®-A8, DM8148 2 x 140 Pins 0.6mm Pitch -

About Embedded - Microcontroller, Microprocessor, FPGA Modules


These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.