| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Requires | Package / Case | Polarization | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S060-FG484I | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 484-BGA | - | - | |
| XCZU11EG-L2FFVC1156E | Xilinx | IC FPGA 360 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | Tray | - | - | - | 1156-BBGA, FCBGA | - | - | |
| 10AS057H3F34I2LG | Intel® FPGAs | IC SOC FPGA 492 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | Tray | - | - | - | 1152-BBGA, FCBGA | - | - | |
| XA7Z030-1FBG484I | Xilinx | VIRTEX-7 FBGA BLOCK FBGA484 | Automotive, AEC-Q100, Zynq®-7000 XA | -40°C ~ 100°C (TJ) | Tray | - | - | - | 484-BBGA, FCBGA | - | - | |
| M2S050-FGG484I | Microsemi | IC FPGA SOC 50K LUT 484FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 484-BGA | - | - | |
| M2S050-FGG484 | Microsemi | IC FPGA SOC 50K LUTS 484FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 484-BGA | - | M2S050 | |
| 5CSEBA5U19C7N | Intel® FPGAs | IC FPGA 66 I/O 484UBGA | Cyclone® V SE | 0°C ~ 85°C (TJ) | Tray | - | - | - | 484-FBGA | - | 5CSEBA5 | |
| M2S005-1VF400 | Microsemi | IC FPGA SOC 5K LUTS 400VFBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 400-LFBGA | - | M2S005 | |
| 10AS057N1F40E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | Tray | - | - | - | 1517-BBGA, FCBGA | - | - | |
| BCM33843GUKFSBG | Avago Technologies (Broadcom Limited) | CABLE MODEM | - | - | - | - | - | - | - | - | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.