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    Embedded - System On Chip (SoC)

    Embedded - System On Chip (SoC)

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    Image Part Number Manufacturer Description Series Operating Temperature Packaging RoHS Status Manufacturer Part Number Requires Package / Case Polarization Base Part Number
    Manufacturer Image
    		1SX280LN2F43I2LG Intel® FPGAs 1760-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) Tray - - - - - -
    Manufacturer Image
    		M2S050TS-VF400 Microsemi IC FPGA SOC 50K LUTS SmartFusion®2 0°C ~ 85°C (TJ) Tray - - - 400-LFBGA - -
    Manufacturer Image
    		XCZU3CG-2SBVA484E Xilinx IC FPGA 82 I/O 484FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) Tray - - - 484-BBGA, FCBGA - -
    Manufacturer Image
    		BCM3384ZKFSBG Avago Technologies (Broadcom Limited) CABLE MODEM - - - - - - - - -
    Product Image
    		A2F500M3G-PQ208 Microsemi IC FPGA 500K GATES 512KB 208QFP SmartFusion® 0°C ~ 85°C (TJ) Tray - - - 208-BFQFP - A2F500M3G
    Manufacturer Image
    		BCM7405ZZKFEB03G Avago Technologies (Broadcom Limited) SOC DIGITAL GATEWAY BCM7405 - - - - - - - -
    Product Image
    		10AS066N2F40I2SG Intel® FPGAs IC SOC FPGA 588 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) Tray - - - 1517-BBGA, FCBGA - -
    Manufacturer Image
    		A2F500M3G-1FG256M Microsemi IC FPGA 500K GATES 512KB 256FBGA SmartFusion® -55°C ~ 125°C (TJ) Tray - - - 256-LBGA - A2F500M3G
    Manufacturer Image
    		XCZU2CG-2SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) Tray - - - 784-BBGA, FCBGA - -
    Manufacturer Image
    		10AS032E4F27I3SG Intel® FPGAs 672-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) Tray - - - - - -

    About Embedded - System On Chip (SoC)

    A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.