| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Requires | Package / Case | Polarization | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCZU9EG-3FFVB1156E | Xilinx | IC FPGA 328 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | Tray | - | - | - | 1156-BBGA, FCBGA | - | - | |
| 5ASXMB3G4F40C6N | Altera (Intel® Programmable Solutions Group) | IC FPGA 528 I/O 1517FBGA | Arria V SX | 0°C ~ 85°C (TJ) | Tray | - | - | - | 1517-BBGA, FCBGA | - | 5ASXMB3 | |
| 10AS027H3F34I2LG | Intel® FPGAs | 1152-PIN FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | Tray | - | - | - | - | - | - | |
| M2S100-1FC1152 | Microsemi | IC FPGA SOC 100K LUTS 1152FCBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 1152-BBGA, FCBGA | - | M2S100 | |
| 10AS048K4F35I3LG | Intel® FPGAs | 1152-PIN FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | Tray | - | - | - | - | - | - | |
| M2S060-1FGG676 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 676-BGA | - | - | |
| 10AS032H2F34E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 384 I/O 1152FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | Tray | - | - | - | 1152-BBGA, FCBGA | - | - | |
| M2S025-FCS325I | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 325-TFBGA | - | - | |
| M2S060T-VFG400 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 400-LFBGA | - | - | |
| XCZU19EG-1FFVD1760E | Xilinx | IC FPGA 308 I/O 1760FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | Tray | - | - | - | 1760-BBGA, FCBGA | - | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.