Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S025T-1VFG256 | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 256-LBGA | - | 256-FPBGA (17x17) | - | |
| 5CSEBA6U23C8N | Intel® FPGAs | IC FPGA 145 I/O 672UBGA | Cyclone® V SE | 0°C ~ 85°C (TJ) | - | Tray | - | 672-FBGA | 5CSEBA6 | 672-UBGA (23x23) | - | |
| XCZU28DR-L2FSVE1156I | Xilinx | XCZU28DR-L2FSVE1156I | - | - | - | Tray | - | - | - | - | - | |
| XQ7Z020-1CL484I4332 | 4D Systems | IC FPGA QPRO 484BGA | Zynq®-7000Q | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| XA7Z020-1CLG484I | 4D Systems | IC SOC CORTEX A-9 ZYNQ7 484BGA | Automotive, AEC-Q100, Zynq®-7000 XA | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - | |
| BCM33843DUIFSBG | Avago Technologies (Broadcom Limited) | CABLE MODEM | - | - | - | - | - | - | - | - | - | |
| M2S150TS-1FC1152M | Microsemi | IC FPGA SOC 150K LUTS 1152FCBGA | SmartFusion®2 | -55°C ~ 125°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FCBGA (35x35) | - | |
| M2S090T-FGG676I | Microsemi | IC FPGA SOC 90K LUTS 676FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 676-BGA | - | 676-FBGA (27x27) | - | |
| 5ASXMB5E4F31I3N | Intel® FPGAs | IC FPGA 170 I/O 896FBGA | Arria V SX | -40°C ~ 100°C (TJ) | - | Tray | - | 896-BBGA, FCBGA | 5ASXMB5 | 896-FBGA (31x31) | - | |
| XCZU4EV-L1SFVC784I | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EV | -40°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.