| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Requires | Package / Case | Polarization | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 5ASXFB3H6F40C6N | Intel® FPGAs | IC FPGA 528 I/O 1517FBGA | Arria V SX | 0°C ~ 85°C (TJ) | Tray | - | - | - | 1517-BBGA, FCBGA | - | 5ASXFB3 | |
| M2S025TS-1VFG256I | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 256-LBGA | - | - | |
| 10AS066K4F35I4SGES | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 396 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | Tray | - | - | - | 1152-BBGA, FCBGA | - | - | |
| XCZU27DR-2FFVE1156E | Xilinx | XCZU27DR-2FFVE1156E | - | - | Tray | - | - | - | - | - | - | |
| 10AS066N2F40I1HG | Intel® FPGAs | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | Tray | - | - | - | 1517-BBGA, FCBGA | - | - | |
| XCZU7EG-1FFVC1156E | Xilinx | IC FPGA 360 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | Tray | - | - | - | 1156-BBGA, FCBGA | - | - | |
| M2S050T-FCS325I | Microsemi | IC FPGA SOC 50K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 325-TFBGA | - | - | |
| M2S025-1FG484I | Microsemi | IC FPGA SOC 25K LUTS 484FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 484-BGA | - | M2S025 | |
| M2S090TS-FCS325 | Microsemi | IC FPGA SOC 90K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 325-TFBGA | - | - | |
| M2S090-FCSG325I | Microsemi | IC FPGA SOC 90K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 325-TFBGA | - | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.