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    Embedded - System On Chip (SoC)

    Embedded - System On Chip (SoC)

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    Image Part Number Manufacturer Description Series Operating Temperature Packaging RoHS Status Manufacturer Part Number Requires Package / Case Polarization Base Part Number
    Manufacturer Image
    		M2S010TS-1VF256I Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 256-VFBGA - -
    Manufacturer Image
    		M2S025TS-VFG256 Microsemi IC FPGA SOC 25K LUTS SmartFusion®2 0°C ~ 85°C (TJ) Tray - - - 256-LBGA - -
    Manufacturer Image
    		XCZU4CG-2SFVC784I Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) Tray - - - 784-BBGA, FCBGA - -
    Manufacturer Image
    		BCM7405ZZKFEB01G Avago Technologies (Broadcom Limited) SOC DIGITAL GATEWAY BCM7405 - - - - - - - -
    Manufacturer Image
    		XC7Z007S-1CLG400C Xilinx IC FPGA SOC 100I/O 400BGA Zynq®-7000 0°C ~ 85°C (TJ) Tray - - - 400-LFBGA, CSPBGA - -
    Product Image
    		5CSXFC6C6U23A7N Intel® FPGAs IC FPGA 145 I/O 672UBGA Automotive, AEC-Q100, Cyclone® V SE -40°C ~ 125°C (TJ) Tray - - - 672-FBGA - 5CSXFC6
    Product Image
    		5CSEBA4U23I7N Intel® FPGAs IC FPGA 224 I/O 672UBGA Cyclone® V SE -40°C ~ 100°C (TJ) Tray - - - 672-FBGA - 5CSEBA4
    Manufacturer Image
    		M2S090-FGG676I Microsemi IC FPGA SOC 90K LUTS 676FBGA SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 676-BGA - -
    Product Image
    		10AS057K2F35E2LG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) Tray - - - 1152-BBGA, FCBGA - -
    Manufacturer Image
    		10AS027H2F35I1HG Intel® FPGAs IC SOC FPGA 384 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) Tray - - - 1152-BBGA, FCBGA - -

    About Embedded - System On Chip (SoC)

    A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.