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Embedded - System On Chip (SoC)
Embedded - System On Chip (SoC)
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- Integrated Circuits (ICs)
- Embedded - System On Chip (SoC)
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XCZU11EG-2FFVC1760E | Xilinx | IC FPGA 512 I/O 1760FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 1760-BBGA, FCBGA | - | 1760-FCBGA (42.5x42.5) | - |
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BCM3384DUKFSBG | Avago Technologies (Broadcom Limited) | CABLE MODEM | - | - | - | - | - | - | - | - | - |
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BCM33838MKFEBG-C2C | Avago Technologies (Broadcom Limited) | MODEM DOCSIS 3.0 8X4 | - | - | - | - | - | - | - | - | - |
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M2S005S-TQG144 | Microsemi | IC FPGA SOC 5K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 144-LQFP | - | 144-TQFP (20x20) | - |
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XCZU25DR-2FFVG1517E | Xilinx | XCZU25DR-2FFVG1517E | - | - | - | Tray | - | - | - | - | - |
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XCZU28DR-L1FFVE1156I | Xilinx | XCZU28DR-L1FFVE1156I | - | - | - | Tray | - | - | - | - | - |
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XA7Z010-1CLG225I | 4D Systems | IC SOC CORTEX A-9 ZYNQ7 225BGA | Automotive, AEC-Q100, Zynq®-7000 XA | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - |
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1SX280LN3F43I1VG | Intel® FPGAs | 1760-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
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XAZU3EG-L1SFVA625I | Xilinx | XAZU3EG-L1SFVA625I | - | - | - | Tray | - | - | - | - | - |
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M2S060TS-1FGG484I | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - |
About Embedded - System On Chip (SoC)
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.