| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Requires | Package / Case | Polarization | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCM3384GUKFSBG | Avago Technologies (Broadcom Limited) | CABLE MODEM | - | - | - | - | - | - | - | - | - | |
| 5CSEBA6U23I7SN | Intel® FPGAs | IC FPGA 145 I/O 672UBGA | Cyclone® V SE | -40°C ~ 100°C (TJ) | Tray | - | - | - | 672-FBGA | - | 5CSEBA6 | |
| 5CSEBA4U23C8N | Intel® FPGAs | IC FPGA 188 I/O 672UBGA | Cyclone® V SE | 0°C ~ 85°C (TJ) | Tray | - | - | - | 672-FBGA | - | - | |
| XCZU6CG-L2FFVC900E | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | Tray | - | - | - | 900-BBGA, FCBGA | - | - | |
| XCZU7EG-2FBVB900I | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | Tray | - | - | - | 900-BBGA, FCBGA | - | - | |
| M2S025-VF256 | Microsemi | IC FPGA SOC 25K LUTS 256VF | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 256-VFBGA | - | - | |
| XCZU7EG-2FFVC1156I | Xilinx | IC FPGA 360 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | Tray | - | - | - | 1156-BBGA, FCBGA | - | - | |
| 5CSEBA2U19I7N | Intel® FPGAs | IC FPGA 240 I/O 484UBGA | Cyclone® V SE | -40°C ~ 100°C (TJ) | Tray | - | - | - | 484-FBGA | - | 5CSEBA2 | |
| M2S025-1VF256I | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 256-VFBGA | - | - | |
| 5CSEBA4U19A7N | Intel® FPGAs | IC FPGA 161 I/O 484FBGA | Automotive, AEC-Q100, Cyclone® V SE | -40°C ~ 125°C (TJ) | Tray | - | - | - | 484-FBGA | - | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.