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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XCZU4CG-1FBVB900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
XCZU7EG-L2FFVC1156E Xilinx IC FPGA 360 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
M2S050TS-1FG896 Microsemi IC FPGA SOC 50K LUTS 896FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 896-BGA - 896-FBGA (31x31) -
5ASXFB5G4F35C4N Intel® FPGAs IC FPGA 350 I/O 1152FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA 5ASXFB5 1152-FBGA (35x35) -
M2S025TS-1FG484I Microsemi IC FPGA SOC 25K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA M2S025TS 484-FPBGA (23x23) -
XCZU7EV-L2FBVB900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
M2S060TS-1FG484M Microsemi IC FPGA SOC SmartFusion®2 -55°C ~ 125°C (TJ) - Tray - - - - -
M2S090TS-1FG484I Microsemi IC FPGA SOC 90K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA M2S090TS 484-FPBGA (23x23) -
XCZU6CG-2FFVC900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
A2F200M3F-FGG256 Microsemi IC FPGA 256K FLASH 256FBGA SmartFusion® 0°C ~ 85°C (TJ) - Tray - 256-LBGA A2F200 256-FBGA (17x17) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.