| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Requires | Package / Case | Polarization | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A2F500M3G-FG256M | Microsemi | IC FPGA 500K GATES 512KB 256FBGA | SmartFusion® | -55°C ~ 125°C (TJ) | Tray | - | - | - | 256-LBGA | - | A2F500M3G | |
| 1SX280LN2F43E2VG | Intel® FPGAs | 1760-PIN FBGA | Stratix® 10 SX | 0°C ~ 100°C (TJ) | Tray | - | - | - | - | - | - | |
| 10AS048E3F29I2LG | Intel® FPGAs | 780-PIN FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | Tray | - | - | - | - | - | - | |
| M2S010-1TQ144I | Microsemi | IC FPGA SOC 10K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 144-LQFP | - | - | |
| XC7Z100-1FFG900I | Xilinx | IC SOC CORTEX-A9 KINTEX7 900FBGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 900-BBGA, FCBGA | - | XC7Z100 | |
| M2S010S-1FGG484I | Microsemi | IC FPGA SOC 10K LUTS 484FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 484-BGA | - | M2S010S | |
| XCZU4EG-2SFVC784E | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | Tray | - | - | - | 784-BBGA, FCBGA | - | - | |
| XCZU4CG-1FBVB900E | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC CG | 0°C ~ 100°C (TJ) | Tray | - | - | - | 900-BBGA, FCBGA | - | - | |
| XCZU7EG-L2FFVC1156E | Xilinx | IC FPGA 360 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | Tray | - | - | - | 1156-BBGA, FCBGA | - | - | |
| M2S050TS-1FG896 | Microsemi | IC FPGA SOC 50K LUTS 896FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 896-BGA | - | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.