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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S050TS-1FCSG325I Microsemi IC FPGA SOC 50K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
5CSTFD5D5F31I7N Altera (Intel® Programmable Solutions Group) IC FPGA 288 I/O 896FBGA Cyclone® V ST -40°C ~ 100°C (TJ) - Tray - 896-BGA 5CSTFD5 896-FBGA (31x31) -
BCM3384GKFSBG Avago Technologies (Broadcom Limited) CABLE MODEM - - - - - - - - -
10AS066N3F40I2SG Intel® FPGAs IC SOC FPGA 588 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
XCZU7EV-1FFVF1517E Xilinx IC FPGA 464 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
5CSEBA5U19I7LN Intel® FPGAs 484-PIN UBGA - - - Tray - - - - -
10AS032H1F35E1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 384 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
XC7Z045-1FFG676I Xilinx IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA XC7Z045 676-FCBGA (27x27) -
XCZU17EG-1FFVE1924E Xilinx IC FPGA 668 I/O 1924FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1924-BBGA, FCBGA - 1924-FCBGA (45x45) -
M2S060TS-1VF400 Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.