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    Embedded - System On Chip (SoC)

    Embedded - System On Chip (SoC)

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    Image Part Number Manufacturer Description Series Operating Temperature Packaging RoHS Status Manufacturer Part Number Requires Package / Case Polarization Base Part Number
    Manufacturer Image
    		M2S060-FG676 Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 0°C ~ 85°C (TJ) Tray - - - 676-BGA - -
    Product Image
    		5ASXBB5D4F35C5N Intel® FPGAs IC FPGA 350 I/O 1152FBGA Arria V SX 0°C ~ 85°C (TJ) Tray - - - 1152-BBGA, FCBGA - 5ASXBB5
    Manufacturer Image
    		10AS066K1F35I1HG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) Tray - - - 1152-BBGA, FCBGA - -
    Manufacturer Image
    		M2S025T-VF256 Microsemi IC FPGA SOC 25K LUTS SmartFusion®2 0°C ~ 85°C (TJ) Tray - - - 256-VFBGA - -
    Manufacturer Image
    		M2S025-VFG400I Microsemi IC FPGA SOC 25K LUT 400VFBGA SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 400-LFBGA - -
    Manufacturer Image
    		M2S150TS-FCG1152 Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 0°C ~ 85°C (TJ) Tray - - - 1152-BBGA, FCBGA - -
    Manufacturer Image
    		M2S025S-1FG484I Microsemi IC FPGA SOC 25K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 484-BGA - M2S025S
    Manufacturer Image
    		M2S010S-1FG484I Microsemi IC FPGA SOC 10K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 484-BGA - M2S010S
    Manufacturer Image
    		M2S025TS-1FGG484M Microsemi IC FPGA SOC 25K LUTS 484FBGA SmartFusion®2 -55°C ~ 125°C (TJ) Tray - - - 484-BGA - -
    Manufacturer Image
    		5CSEBA2U19C7SN Intel® FPGAs IC FPGA 161 I/O 484FBGA Cyclone® V SE 0°C ~ 85°C (TJ) Tray - - - 484-FBGA - -

    About Embedded - System On Chip (SoC)

    A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.