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Embedded - System On Chip (SoC)
Embedded - System On Chip (SoC)
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- Integrated Circuits (ICs)
- Embedded - System On Chip (SoC)
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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5CSXFC4C6U23I7LN | Intel® FPGAs | 672-PIN UBGA | - | - | - | Tray | - | - | - | - | - |
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BCM7405ZKFEB08G | Avago Technologies (Broadcom Limited) | SOC DIGITAL GATEWAY | BCM7405 | - | - | - | - | - | - | - | - |
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XC7Z100-L2FFG1156I | 4D Systems | IC SOC CORTEX-A9 KINTEX7 1156BGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | - | - | - | - | - | - |
|
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1SX280LU3F50I2VG | Intel® FPGAs | 2397-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
|
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1SX280LN3F43E3VG | Intel® FPGAs | 1760-PIN FBGA | Stratix® 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
|
XC7Z035-1FFG900C | Xilinx | IC SOC CORTEX-A9 KINTEX7 900BGA | Zynq®-7000 | 0°C ~ 85°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - |
|
|
1SX280LH2F55I2LG | Intel® FPGAs | 2912-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
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M2S005S-VFG256 | Microsemi | IC FPGA SOC 5K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 256-LBGA | - | 256-FPBGA (17x17) | - |
|
5ASXBB3D4F35I5N | Intel® FPGAs | IC FPGA 350 I/O 1152FBGA | Arria V SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | 5ASXBB3 | 1152-FBGA (35x35) | - |
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M2S005-TQ144 | Microsemi | IC FPGA SOC 5K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 144-LQFP | - | 144-TQFP (20x20) | - |
About Embedded - System On Chip (SoC)
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.