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    Embedded - System On Chip (SoC)

    Embedded - System On Chip (SoC)

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    Image Part Number Manufacturer Description Series Operating Temperature Packaging RoHS Status Manufacturer Part Number Requires Package / Case Polarization Base Part Number
    Product Image
    		5ASXFB5G4F35C4N Intel® FPGAs IC FPGA 350 I/O 1152FBGA Arria V SX 0°C ~ 85°C (TJ) Tray - - - 1152-BBGA, FCBGA - 5ASXFB5
    Manufacturer Image
    		M2S025TS-1FG484I Microsemi IC FPGA SOC 25K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 484-BGA - M2S025TS
    Manufacturer Image
    		XCZU7EV-L2FBVB900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) Tray - - - 900-BBGA, FCBGA - -
    Manufacturer Image
    		M2S060TS-1FG484M Microsemi IC FPGA SOC SmartFusion®2 -55°C ~ 125°C (TJ) Tray - - - - - -
    Manufacturer Image
    		M2S090TS-1FG484I Microsemi IC FPGA SOC 90K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 484-BGA - M2S090TS
    Manufacturer Image
    		XCZU6CG-2FFVC900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) Tray - - - 900-BBGA, FCBGA - -
    Manufacturer Image
    		A2F200M3F-FGG256 Microsemi IC FPGA 256K FLASH 256FBGA SmartFusion® 0°C ~ 85°C (TJ) Tray - - - 256-LBGA - A2F200
    Manufacturer Image
    		XCZU4EV-1SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) Tray - - - 784-BBGA, FCBGA - -
    Manufacturer Image
    		XAZU3EG-1SFVC784I Xilinx XAZU3EG-1SFVC784I - - Tray - - - 784-BFBGA, FCBGA - -
    Product Image
    		5ASXBB5D6F31C6N Intel® FPGAs IC FPGA 170 I/O 896FBGA Arria V SX 0°C ~ 85°C (TJ) Tray - - - 896-BBGA, FCBGA - 5ASXBB5

    About Embedded - System On Chip (SoC)

    A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.