| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Requires | Package / Case | Polarization | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 5CSXFC6D6F31C8NES | Altera (Intel® Programmable Solutions Group) | IC FPGA 288 I/O 896FBGA | Cyclone® V SX | 0°C ~ 85°C (TJ) | Tray | - | - | - | 896-BGA | - | 5CSXFC6 | |
| XCZU7EG-3FBVB900E | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | Tray | - | - | - | 900-BBGA, FCBGA | - | - | |
| XC7Z035-2FFG676E | Xilinx | IC SOC CORTEX-A9 KINTEX7 676BGA | Zynq®-7000 | 0°C ~ 100°C (TJ) | Tray | - | - | - | 676-BBGA, FCBGA | - | - | |
| M2S025-1FCSG325 | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 325-TFBGA | - | - | |
| M2S150TS-1FCS536I | Microsemi | IC FPGA SOC 150K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 536-LFBGA | - | - | |
| 5CSEBA6U19C7N | Intel® FPGAs | IC FPGA 66 I/O 484UBGA | Cyclone® V SE | 0°C ~ 85°C (TJ) | Tray | - | - | - | 484-FBGA | - | 5CSEBA6 | |
| A2F500M3G-FGG256M | Microsemi | IC FPGA 500K GATES 512KB 256FBGA | SmartFusion® | -55°C ~ 125°C (TJ) | Tray | - | - | - | 256-LBGA | - | A2F500M3G | |
| 1SX280LN2F43E2LG | Intel® FPGAs | 1760-PIN FBGA | Stratix® 10 SX | 0°C ~ 100°C (TJ) | Tray | - | - | - | - | - | - | |
| 10AS066N2F40I2SGES | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 588 I/O 1517FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | Tray | - | - | - | 1517-BBGA, FCBGA | - | - | |
| M2S060T-1FCS325 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 325-TFBGA | - | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.