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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GAL20V8B-15QPN | Lattice Semiconductor | IC CPLD 8MC 15NS 24DIP | GAL®20V8 | 0°C ~ 75°C (TA) | Tube | Through Hole | - | - | - | - | 24-DIP (0.300", 7.62mm) | |
| GAL16V8D-10QJ | Lattice Semiconductor | IC CPLD 8MC 10NS 20PLCC | GAL®16V8 | 0°C ~ 75°C (TA) | Bulk | Surface Mount | - | - | - | - | 20-LCC (J-Lead) | |
| M5LV-128/74-10VC | Lattice Semiconductor | IC CPLD 128MC 10NS 100TQFP | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| EPM7128EQC100-10PY | Altera (Intel® Programmable Solutions Group) | IC CPLD 128MC 10NS 100QFP | MAX® 7000 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP | |
| LC4384C-5FT256I | Lattice Semiconductor | IC CPLD 384MC 5NS 256FTBGA | ispMACH® 4000C | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| EPM7064LC68-15YY | Altera (Intel® Programmable Solutions Group) | IC CPLD 64MC 15NS 68PLCC | MAX® 7000 | 0°C ~ 70°C (TA) | Tray | - | - | - | - | - | - | |
| ATF1504ASL-20JC68 | Micrel / Microchip Technology | IC CPLD 64MC 20NS 68PLCC | ATF15xx | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 68-LCC (J-Lead) | |
| M4A3-256/128-7YNI | Lattice Semiconductor | IC CPLD 256MC 7.5NS 208QFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| GAL16V8D-10QJN | Lattice Semiconductor | IC CPLD 8MC 10NS 20PLCC | GAL®16V8 | 0°C ~ 75°C (TA) | Bulk | Surface Mount | - | - | - | - | 20-LCC (J-Lead) | |
| M5-320/192-10SAC | Lattice Semiconductor | IC CPLD 320MC 10NS 256SBGA | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-LBGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.