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Embedded - CPLDs (Complex Programmable Logic Devices)

Embedded - CPLDs (Complex Programmable Logic Devices)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - CPLDs (Complex Programmable Logic Devices)
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Package / Case
ATF2500C-10JC Micrel / Microchip Technology IC CPLD 24 MACRO 10NS 44PLCC ATF2500C(L) 0°C ~ 70°C (TA) Tube Surface Mount - - - - 44-LCC (J-Lead)
EPM7064AETC44-10 Altera (Intel® Programmable Solutions Group) IC CPLD 64MC 10NS 44TQFP MAX® 7000A 0°C ~ 70°C (TA) Tray Surface Mount - - - - 44-TQFP
LC4064V-75TN100I Lattice Semiconductor IC CPLD 64MC 7.5NS 100TQFP ispMACH® 4000V -40°C ~ 105°C (TJ) Tray Surface Mount - - - - 100-LQFP
EPM3128ATC100-7N Altera (Intel® Programmable Solutions Group) IC CPLD 128MC 7.5NS 100TQFP MAX® 3000A 0°C ~ 70°C (TA) Tray Surface Mount - - - - 100-TQFP
EPM3128AFI256-10N Altera (Intel® Programmable Solutions Group) IC CPLD 128MC 10NS 256FBGA MAX® 3000A -40°C ~ 85°C (TA) Tray Surface Mount - - - - 256-BGA
ATV2500B-15KI Micrel / Microchip Technology IC CPLD 15NS CERAMIC 44JLCC ATV2500B(L) and BQ(L) -40°C ~ 85°C (TA) Tube Surface Mount - - - - 44-CLCC, Window (J-Lead)
M4A3-256/192-10FANI Lattice Semiconductor IC CPLD 256MC 10NS 256FBGA ispMACH® 4A -40°C ~ 85°C (TA) Tray Surface Mount - - - - 256-BGA
M4A3-64/64-7VC Lattice Semiconductor IC CPLD 64MC 7.5NS 44TQFP ispMACH® 4A 0°C ~ 70°C (TA) Tray Surface Mount - - - - 44-TQFP
ATF750C-10JU Micrel / Microchip Technology IC CPLD 10MC 10NS 28PLCC ATF750C(L) -40°C ~ 85°C (TA) Tube Surface Mount - - - - 28-LCC (J-Lead)
XC9572XV-5CS48C Xilinx IC CPLD 72MC 5NS 48CSP XC9500XV 0°C ~ 70°C (TA) Tray Surface Mount - - - - 48-FBGA, CSPBGA

About Embedded - CPLDs (Complex Programmable Logic Devices)


CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.