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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
10AS016C3U19I2SG Intel® FPGAs IC SOC FPGA 192 I/O 484UBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 484-BFBGA, FCBGA - 484-UBGA (19x19) -
XC7Z014S-2CLG484E Xilinx IC FPGA SOC 200I/O 484BGA Zynq®-7000 0°C ~ 100°C (TJ) - Tray - 484-LFBGA, CSPBGA - 484-CSPBGA (19x19) -
XC7Z015-2CL485I Xilinx IC FPGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 484-LFBGA, CSPBGA - 484-CSPBGA (19x19) -
XCZU7EV-1FBVB900I Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EV -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
5CSXFC6D6F31C8NES Altera (Intel® Programmable Solutions Group) IC FPGA 288 I/O 896FBGA Cyclone® V SX 0°C ~ 85°C (TJ) - Tray - 896-BGA 5CSXFC6 896-FBGA (31x31) -
M2S090T-FCSG325I Microsemi IC FPGA SOC 90K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
XCZU7EG-3FBVB900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
XC7Z035-2FFG676E Xilinx IC SOC CORTEX-A9 KINTEX7 676BGA Zynq®-7000 0°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA - 676-FCBGA (27x27) -
M2S025-1FCSG325 Microsemi IC FPGA SOC 25K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
M2S150TS-1FCS536I Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 536-LFBGA - 536-BGA (16x16) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.