| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Requires | Package / Case | Polarization | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XCZU5EG-L1FBVB900I | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EG | -40°C ~ 100°C (TJ) | Tray | - | - | - | 900-BBGA, FCBGA | - | - | |
| 10AS016E4F29E3SG | Intel® FPGAs | IC SOC FPGA 288 I/O 780FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | Tray | - | - | - | 780-BBGA, FCBGA | - | - | |
| XCZU11EG-L2FFVB1517E | Xilinx | IC FPGA 488 I/O 1517FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | Tray | - | - | - | 1517-BBGA, FCBGA | - | - | |
| M2S025-1FCS325I | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 325-TFBGA | - | - | |
| M2S150TS-FCS536I | Microsemi | IC FPGA SOC 150K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 536-LFBGA | - | - | |
| 10AS027H3F34I2SG | Intel® FPGAs | 1152-PIN FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | Tray | - | - | - | - | - | - | |
| M2S010T-VFG400I | Microsemi | IC FPGA SOC 10K LUT 400VFBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 400-LFBGA | - | - | |
| M2S010TS-VFG400I | Microsemi | IC FPGA SOC 10K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 400-LFBGA | - | - | |
| M2S150-FCG1152I | Microsemi | IC FPGA SOC 150K LUTS 1152FCBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 1152-BBGA, FCBGA | - | - | |
| M2S005-1VF256 | Microsemi | IC FPGA SOC 5K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 256-VFBGA | - | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.