Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

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Image Part Number Manufacturer Description Series Operating Temperature Packaging RoHS Status Manufacturer Part Number Requires Package / Case Polarization Base Part Number
A2F200M3F-FG484 Microsemi IC FPGA 200K GATES 256KB 484-BGA SmartFusion® 0°C ~ 85°C (TJ) Tray - - - 484-BGA - A2F200
A2F060M3E-1FG256M Microsemi IC FPGA 60K GATES 128KB 256FBGA SmartFusion® -55°C ~ 125°C (TJ) Tray - - - 256-LBGA - A2F060M3E
M2S050T-1FCSG325I Microsemi IC FPGA SOC 50K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 325-TFBGA - -
XCZU4EV-1FBVB900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) Tray - - - 900-BBGA, FCBGA - -
10AS016E3F27E1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 240 I/O 672FBGA Arria 10 SX 0°C ~ 100°C (TJ) Tray - - - 672-BBGA, FCBGA - -
10AS066H2F34I2LG Intel® FPGAs IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) Tray - - - 1152-BBGA, FCBGA - -
10AS032H2F34I1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 384 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) Tray - - - 1152-BBGA, FCBGA - -
1SX280LN3F43E1VG Intel® FPGAs 1760-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) Tray - - - - - -
XCZU7CG-2FBVB900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) Tray - - - 900-BBGA, FCBGA - -
5CSEBA4U19C7N Intel® FPGAs IC FPGA 161 I/O 484FBGA Cyclone® V SE 0°C ~ 85°C (TJ) Tray - - - 484-FBGA - -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.