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Embedded - System On Chip (SoC)
Embedded - System On Chip (SoC)
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- Integrated Circuits (ICs)
- Embedded - System On Chip (SoC)
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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M2S090TS-1FGG676 | Microsemi | IC FPGA SOC 90K LUTS 676FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 676-BGA | - | 676-FBGA (27x27) | - |
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M2S010-TQ144 | Microsemi | IC FPGA SOC 10K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 144-LQFP | - | 144-TQFP (20x20) | - |
|
1SX250LU3F50I2VG | Intel® FPGAs | 2397-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
|
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5ASXMB3G4F40C5N | Intel® FPGAs | IC FPGA 528 I/O 1517FBGA | Arria V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | 5ASXMB3 | 1517-FBGA (40x40) | - |
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10AS048E2F29E1HG | Intel® FPGAs | IC SOC FPGA 360 I/O 780FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 780-BBGA, FCBGA | - | 780-FBGA (29x29) | - |
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BCM33843MVKFSBG | Avago Technologies (Broadcom Limited) | CABLE MODEM | - | - | - | - | - | - | - | - | - |
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A2F060M3E-CSG288 | Microsemi | IC FPGA 60K GATES 128KB 288-CSP | SmartFusion® | 0°C ~ 85°C (TJ) | - | Tray | - | 288-TFBGA, CSPBGA | A2F060M3E | 288-CSP (11x11) | - |
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5ASXFB5H4F40I3N | Intel® FPGAs | IC FPGA 528 I/O 1517FBGA | Arria V SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | 5ASXFB5 | 1517-FBGA (40x40) | - |
|
XCZU2CG-2SFVC784I | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC CG | -40°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - |
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M2S060-FG676 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 676-BGA | - | 676-FBGA (27x27) | - |
About Embedded - System On Chip (SoC)
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.