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    Embedded - System On Chip (SoC)

    Embedded - System On Chip (SoC)

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    Image Part Number Manufacturer Description Series Operating Temperature Packaging RoHS Status Manufacturer Part Number Requires Package / Case Polarization Base Part Number
    Manufacturer Image
    		XCZU3EG-1SFVC784I Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) Tray - - - 784-BBGA, FCBGA - -
    Manufacturer Image
    		A2F200M3F-CS288I Microsemi IC FPGA 200K GATES 256KB 288-CSP SmartFusion® -40°C ~ 100°C (TJ) Tray - - - 288-TFBGA, CSPBGA - A2F200
    Manufacturer Image
    		XCZU11EG-2FFVC1156E Xilinx IC FPGA 360 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) Tray - - - 1156-BBGA, FCBGA - -
    Manufacturer Image
    		M2S025T-1VF256 Microsemi IC FPGA SOC 25K LUTS SmartFusion®2 0°C ~ 85°C (TJ) Tray - - - 256-VFBGA - -
    Product Image
    		5CSEBA4U23C7N Intel® FPGAs IC FPGA 188 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) Tray - - - 672-FBGA - -
    Manufacturer Image
    		M2S150-1FCS536I Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 536-LFBGA - -
    Manufacturer Image
    		A2F500M3G-1FG484I Microsemi IC FPGA 500K GATES 512KB 484-BGA SmartFusion® -40°C ~ 100°C (TJ) Tray - - - 484-BGA - A2F500M3G
    Manufacturer Image
    		M2S090TS-FG484I Microsemi IC FPGA SOC 90K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 484-BGA - -
    Manufacturer Image
    		10AS048K3F35I2SG Intel® FPGAs 1152-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) Tray - - - - - -
    Product Image
    		5CSEBA5U23C7SN Intel® FPGAs IC FPGA 145 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) Tray - - - 672-FBGA - 5CSEBA5

    About Embedded - System On Chip (SoC)

    A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.