| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Requires | Package / Case | Polarization | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z030-2FF676I | Xilinx | IC SOC CORTEX-A9 KINTEX7 676FBGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 676-BBGA, FCBGA | - | - | |
| 10AS022C4U19I3SG | Intel® FPGAs | 484-PIN UBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | Tray | - | - | - | - | - | - | |
| 5ASTFD3G3F35I3N | Intel® FPGAs | IC FPGA 350 I/O 1152FBGA | Arria V ST | -40°C ~ 100°C (TJ) | Tray | - | - | - | 1152-BBGA, FCBGA | - | 5ASTFD3 | |
| M2S060TS-FGG676 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 676-BGA | - | - | |
| M2S005S-FG484 | Microsemi | IC FPGA SOC 5K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 484-BGA | - | - | |
| M2S060TS-VFG400 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | Tray | - | - | - | 400-LFBGA | - | - | |
| 10AS057K1F35E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 396 I/O 1152FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | Tray | - | - | - | 1152-BBGA, FCBGA | - | - | |
| 10AS057K2F40E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 696 I/O 1517FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | Tray | - | - | - | 1517-BBGA, FCBGA | - | - | |
| 10AS066K2F40E1HG | Intel® FPGAs | IC SOC FPGA 696 I/O 1517FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | Tray | - | - | - | 1517-BBGA, FCBGA | - | - | |
| M2S050TS-1VFG400I | Microsemi | IC FPGA SOC 50K LUTS 400VFBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | Tray | - | - | - | 400-LFBGA | - | M2S050TS |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.