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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A2F200M3F-FGG484 | Microsemi | IC FPGA 256K FLASH 484FBGA | SmartFusion® | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | A2F200 | 484-FPBGA (23x23) | - | |
| M2S010T-1FG484 | Microsemi | IC FPGA SOC 10K LUTS 484FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | M2S010T | 484-FPBGA (23x23) | - | |
| 5ASXBB5D4F40I5N | Intel® FPGAs | IC FPGA 528 I/O 1517FBGA | Arria V SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | 5ASXBB5 | 1517-FBGA (40x40) | - | |
| 5ASXFB3G4F35C5N | Intel® FPGAs | IC FPGA 350 I/O 1152FBGA | Arria V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | 5ASXFB3 | 1152-FBGA (35x35) | - | |
| 5ASXFB5H4F40I5N | Intel® FPGAs | IC FPGA 528 I/O 1517FBGA | Arria V SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | 5ASXFB5 | 1517-FBGA (40x40) | - | |
| 5CSEBA4U19C6N | Intel® FPGAs | IC FPGA 161 I/O 484FBGA | Cyclone® V SE | 0°C ~ 85°C (TJ) | - | Tray | - | 484-FBGA | - | 484-UBGA (19x19) | - | |
| 10AS066K4F35E3LG | Intel® FPGAs | IC SOC FPGA 396 I/O 1152FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| XCZU7EV-1FFVC1156E | Xilinx | IC FPGA 360 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC EV | 0°C ~ 100°C (TJ) | - | Tray | - | 1156-BBGA, FCBGA | - | 1156-FCBGA (35x35) | - | |
| 5ASXMB5E4F31C5N | Intel® FPGAs | IC FPGA 170 I/O 896FBGA | Arria V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 896-BBGA, FCBGA | 5ASXMB5 | 896-FBGA (31x31) | - | |
| XC7Z045-1FBG676C | Xilinx | IC SOC CORTEX-A9 KINTEX7 676FBGA | Zynq®-7000 | 0°C ~ 85°C (TJ) | - | Tray | - | 676-BBGA, FCBGA | XC7Z045 | 676-FCBGA (27x27) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.