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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
A2F200M3F-FGG484 Microsemi IC FPGA 256K FLASH 484FBGA SmartFusion® 0°C ~ 85°C (TJ) - Tray - 484-BGA A2F200 484-FPBGA (23x23) -
M2S010T-1FG484 Microsemi IC FPGA SOC 10K LUTS 484FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA M2S010T 484-FPBGA (23x23) -
5ASXBB5D4F40I5N Intel® FPGAs IC FPGA 528 I/O 1517FBGA Arria V SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA 5ASXBB5 1517-FBGA (40x40) -
5ASXFB3G4F35C5N Intel® FPGAs IC FPGA 350 I/O 1152FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA 5ASXFB3 1152-FBGA (35x35) -
5ASXFB5H4F40I5N Intel® FPGAs IC FPGA 528 I/O 1517FBGA Arria V SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA 5ASXFB5 1517-FBGA (40x40) -
5CSEBA4U19C6N Intel® FPGAs IC FPGA 161 I/O 484FBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 484-FBGA - 484-UBGA (19x19) -
10AS066K4F35E3LG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
XCZU7EV-1FFVC1156E Xilinx IC FPGA 360 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
5ASXMB5E4F31C5N Intel® FPGAs IC FPGA 170 I/O 896FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 896-BBGA, FCBGA 5ASXMB5 896-FBGA (31x31) -
XC7Z045-1FBG676C Xilinx IC SOC CORTEX-A9 KINTEX7 676FBGA Zynq®-7000 0°C ~ 85°C (TJ) - Tray - 676-BBGA, FCBGA XC7Z045 676-FCBGA (27x27) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.