Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

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Image Part Number Manufacturer Description Series Operating Temperature Packaging RoHS Status Manufacturer Part Number Requires Package / Case Polarization Base Part Number
5CSEBA5U23I7N Altera (Intel® Programmable Solutions Group) IC FPGA 145 I/O 672UBGA Cyclone® V SE -40°C ~ 100°C (TJ) Tray - - - 672-FBGA - 5CSEBA5
10AS016E4F27E3LG Intel® FPGAs IC SOC FPGA 240 I/O 672FBGA Arria 10 SX 0°C ~ 100°C (TJ) Tray - - - 672-BBGA, FCBGA - -
XC7Z030-L2FBG676I Xilinx IC SOC CORTEX-A9 KINTEX7 676BGA Zynq®-7000 -40°C ~ 100°C (TJ) Tray - - - 676-BBGA, FCBGA - -
M2S005S-1VFG256I Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) Tray - - - 256-LBGA - -
M2S010TS-FG484 Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 0°C ~ 85°C (TJ) Tray - - - 484-BGA - -
XCZU2EG-1SFVA625E Xilinx IC FPGA 180 I/O 625FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) Tray - - - 625-BFBGA, FCBGA - -
XCZU6EG-1FFVC900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) Tray - - - 900-BBGA, FCBGA - -
1SX250LH2F55E1VG Intel® FPGAs 2912-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) Tray - - - - - -
10AS048K2F35I1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) Tray - - - 1152-BBGA, FCBGA - -
10AS066K1F40I1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) Tray - - - 1517-BBGA, FCBGA - -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.