| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TE0723-02 | Trenz Electronic | SOM ARDUZYNQ 7Z10 USBOTG MICROSD | TE0723 | 0°C ~ 70°C | - | - | MCU, FPGA | - | ARM Cortex-A9 | Arduino | - | |
| CC-9P-V513-C | Digi International | MODULE 9P 16MB SDRAM 8MB FLASH | ConnectCore® | -40°C ~ 85°C | - | 1.97" x 1.97" (50mm x 50mm) | MPU Core | - | ARM926EJ-S, NS9215 | Board-to-Board (BTB) Socket - 160 | - | |
| SOMDIMM-RX63N | Future Designs, Inc. | DIMM 16MB 10/100 RX63N REV2 | - | - | - | - | MCU Core | - | RX600, RX63N | SO-DIMM-200 | - | |
| CENGLH7A404-11-430EI | Logic PD, Inc. | CARD ENGINE 16MB FLASH 32MB RAM | - | -40°C ~ 85°C | - | 2.37" x 2.67" (60.2mm x 67.8mm) | MPU Core | - | ARM922T, LH7A404 | SO-DIMM-144 | - | |
| 28020 | Parallax, Inc. | PWMPAL 4 OUTPUT CHANNELS | - | - | - | - | - | - | - | - | - | |
| 20-101-1051 | Digi International | MODULE RABBITCORE RCM3365 | RabbitCore® | 0°C ~ 70°C | - | 1.85" x 2.73" (47mm x 69mm) | MPU Core | - | Rabbit 3000 | 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card | - | |
| CENGLH7A400-10-504HI | Logic PD, Inc. | CARD ENGINE 32MB FLASH 64MB RAM | - | -40°C ~ 85°C | - | 2.37" x 2.67" (60.2mm x 67.8mm) | MPU Core | - | ARM922T, LH7A400 | SO-DIMM-144 | - | |
| 20-101-1319 | Digi International | MINCORE MODULE RCM6710 | MiniCore® | -40°C ~ 85°C | - | 1.2" x 2" (30mm x 51mm) | MPU Core | - | Rabbit 6000 | Edge Connector - 52 | - | |
| BS2P24 | Parallax, Inc. | BASIC STAMP 2P24 MODULE | BASIC Stamp® | 0°C ~ 70°C | - | 1.2" x 0.6" (30mm x 15mm) | MCU Core | - | SX48AC | - | - | |
| TE0722-02I | Trenz Electronic | SOM ZYNQ SOFT PROPELLER 40DIP | TE0722 | -40°C ~ 85°C | - | 0.71" x 2.01" (18mm x 51mm) | MCU, FPGA | - | ARM Cortex-A9 | 40 Pin | - |
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.