Embedded - Microcontroller, Microprocessor, FPGA Modules

Embedded - Microcontroller, Microprocessor, FPGA Modules

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Image Part Number Manufacturer Description Series Operating Temperature Manufacturer Part Number Size / Dimension Module/Board Type Operating System Core Processor Connector Type Reverse Recovery Time (trr)
TE0723-02 Trenz Electronic SOM ARDUZYNQ 7Z10 USBOTG MICROSD TE0723 0°C ~ 70°C - - MCU, FPGA - ARM Cortex-A9 Arduino -
CC-9P-V513-C Digi International MODULE 9P 16MB SDRAM 8MB FLASH ConnectCore® -40°C ~ 85°C - 1.97" x 1.97" (50mm x 50mm) MPU Core - ARM926EJ-S, NS9215 Board-to-Board (BTB) Socket - 160 -
SOMDIMM-RX63N Future Designs, Inc. DIMM 16MB 10/100 RX63N REV2 - - - - MCU Core - RX600, RX63N SO-DIMM-200 -
CENGLH7A404-11-430EI Logic PD, Inc. CARD ENGINE 16MB FLASH 32MB RAM - -40°C ~ 85°C - 2.37" x 2.67" (60.2mm x 67.8mm) MPU Core - ARM922T, LH7A404 SO-DIMM-144 -
28020 Parallax, Inc. PWMPAL 4 OUTPUT CHANNELS - - - - - - - - -
20-101-1051 Digi International MODULE RABBITCORE RCM3365 RabbitCore® 0°C ~ 70°C - 1.85" x 2.73" (47mm x 69mm) MPU Core - Rabbit 3000 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card -
CENGLH7A400-10-504HI Logic PD, Inc. CARD ENGINE 32MB FLASH 64MB RAM - -40°C ~ 85°C - 2.37" x 2.67" (60.2mm x 67.8mm) MPU Core - ARM922T, LH7A400 SO-DIMM-144 -
20-101-1319 Digi International MINCORE MODULE RCM6710 MiniCore® -40°C ~ 85°C - 1.2" x 2" (30mm x 51mm) MPU Core - Rabbit 6000 Edge Connector - 52 -
BS2P24 Parallax, Inc. BASIC STAMP 2P24 MODULE BASIC Stamp® 0°C ~ 70°C - 1.2" x 0.6" (30mm x 15mm) MCU Core - SX48AC - -
TE0722-02I Trenz Electronic SOM ZYNQ SOFT PROPELLER 40DIP TE0722 -40°C ~ 85°C - 0.71" x 2.01" (18mm x 51mm) MCU, FPGA - ARM Cortex-A9 40 Pin -

About Embedded - Microcontroller, Microprocessor, FPGA Modules


These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.