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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
M5475AFE | NXP Semiconductors / Freescale | MODULE FIRE ENGINE | ColdFire® | 0°C ~ 70°C | - | - | - | - | - | - | - |
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CC-9P-V236-Z1 | Digi International | MODULE 9P 64MB SDRAM 64MB FLASH | ConnectCore® | - | - | - | - | - | - | - | - |
|
TE0720-03-1CR | Trenz Electronic | SOM SOC 7Z020-1CLG484C 256MB DDR | TE0720 | 0°C ~ 70°C | - | - | - | - | - | - | - |
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3354-HX-XX7-RC | Critical Link | MOD MITYSOM-3354 | MitySOM | 0°C ~ 70°C | - | - | - | - | - | - | - |
|
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DC-ME-01T-IZU-1 | Digi International | MODULE DIGI CONNECT ME | - | - | - | - | - | - | - | - | - |
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JS1-IC | Parallax, Inc. | MODULE BASIC STAMP JAVELIN | Javelin | 0°C ~ 70°C | - | - | - | - | - | - | - |
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3352-HX-XX7-RI | Critical Link | MITYSOM-3352 W/ AM3352 | MitySOM | -40°C ~ 85°C | - | - | - | - | - | - | - |
|
20-101-1305 | Digi International | RCM3700 W/MOUNTING HOLES | RabbitCore® | -40°C ~ 70°C | - | - | - | - | - | - | - |
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MOD5282-100 | NetBurner, Inc. | PROCESSOR MODULE 512KB FLASH | - | 0°C ~ 70°C | - | - | - | - | - | - | - |
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EC-VA-H264-8B-60-1080-MXC-SL | SOC Technologies (System-On-Chip Technologies) | MOD A/V ENCODER 8BIT 60FPS 264HD | H.264-HD Encoder | 0°C ~ 85°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.