Embedded - Microcontroller, Microprocessor, FPGA Modules

Embedded - Microcontroller, Microprocessor, FPGA Modules

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Image Part Number Manufacturer Description Series Operating Temperature Manufacturer Part Number Size / Dimension Module/Board Type Operating System Core Processor Connector Type Reverse Recovery Time (trr)
CC-9P-V225-Z1 Digi International CONNECTCORE ConnectCore® - - - - - - - -
SOMLX800-11-000GC Logic PD, Inc. MODULE SOM LX800 GEODE WO/SODIMM - 0°C ~ 70°C - 3.78" x 4.53" (96mm x 115mm) MPU Core - Geode, LX 800 - -
CENGLH7A404-11-403EC Logic PD, Inc. CARD ENGINE 16MB FLASH 32MB RAM - 0°C ~ 70°C - 2.37" x 2.67" (60.2mm x 67.8mm) MPU Core - ARM922T, LH7A404 SO-DIMM-144 -
SOMAM1808-10-1602AHCR Logic PD, Inc. SYSTEM ON MODULE AM1808 - 0°C ~ 70°C - 1.18" x 1.57" (30mm x 40mm) MPU Core - ARM926EJ-S, AM1808 - -
DC-EM-02T-C-25 Digi International EM 8MB SDRAM 4MB FLASH 25 PAK Digi Connect EM® -40°C ~ 85°C - 1.94" x 1.58" (49.2mm x 40.0mm) MPU Core - ARM7TDMI, NS7520 RJ45 -
CC-9P-V526UJ-EA Digi International MOD 9P 9215 CONNCORE 8MB FLASH ConnectCore® -40°C ~ 85°C - 1.97" x 1.97" (50mm x 50mm) MPU Core - ARM926EJ-S, NS9215 Board-to-Board (BTB) Socket - 160 -
CENGLH7A404-11-503HCR-A Logic PD, Inc. CARD ENGINE 64MB SDRAM - 0°C ~ 70°C - 2.37" x 2.67" (60.2mm x 67.8mm) MPU Core - ARM922T, LH7A404 SO-DIMM-144 -
DC-ME4-01T-JT Digi International MODULE ME CUSTOMIZABLE JTAG Digi Connect ME® -40°C ~ 85°C - 1.45" x 0.75" (36.7mm x 19.1mm) MPU Core - ARM7TDMI, NS7520 RJ45 -
CC-MX-LD79-ZK Digi International MODULE I.MX53 800MHZ 512MB FLASH ConnectCore® -20°C ~ 85°C - 3.23" x 1.97" (82mm x 50mm MPU Core - ARM® Cortex®-A8, i.MX53 Board-to-Board (BTB) Socket - 360 -
20-101-0961 Digi International MODULE RABBITCORE RCM3720 RabbitCore® -40°C ~ 70°C - 1.2" x 2.95" (30mm x 75mm) MPU Core - Rabbit 3000 IDC Header 2x20 -

About Embedded - Microcontroller, Microprocessor, FPGA Modules


These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.