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Embedded - Microcontroller, Microprocessor, FPGA Modules
Embedded - Microcontroller, Microprocessor, FPGA Modules
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- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Lead Free Status | Requires | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SOMOMAP3503-10-1672IFCR | Logic PD, Inc. | SYSTEM ON MODULE LV OMAP3503 | OMAP35x | 0°C ~ 70°C | - | - | - | - | - | - | - |
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DLP-FPGA | DLP Design, Inc. | MODULE USB-TO-FPGA TRAINING TOOL | FPGA | - | - | - | - | - | - | - | - |
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101-0949 | Digi International | MODULE RABBITCORE RCM3360 | RabbitCore® | -40°C ~ 70°C | - | - | - | - | - | - | - |
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101-0961 | Digi International | MODULE RABBITCORE RCM3720 | RabbitCore® | -40°C ~ 70°C | - | - | - | - | - | - | - |
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101-0698 | Digi International | MODULE RABBITCORE RCM3310 | RabbitCore® | -40°C ~ 70°C | - | - | - | - | - | - | - |
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CC-9C-V212-Z1 | Digi International | MODULE 9C 16MB SDRAM 4MB FLASH | ConnectCore® | -40°C ~ 85°C | - | - | - | - | - | - | - |
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TE0711-01-35-2I | Trenz Electronic | SOM ARTIX-7 HIGH IO 35T USB 2I | TE0711 | -40°C ~ 85°C | - | - | - | - | - | - | - |
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CC-W9M-NA37-XE-B | Digi International | MOD WI-9M 64MB SDRAM 128MB FLASH | ConnectCore® | -40°C ~ 65°C | - | - | - | - | - | - | - |
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20-101-1309 | Digi International | MODULE WI-FI RCM5650W | MiniCore® | -30°C ~ 55°C | - | - | - | - | - | - | - |
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DC-EM-02T-S-25 | Digi International | EM 8MB SDRAM 4MB FLASH 25 PAK | Digi Connect EM® | -40°C ~ 85°C | - | - | - | - | - | - | - |
About Embedded - Microcontroller, Microprocessor, FPGA Modules
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.