Embedded - Microcontroller, Microprocessor, FPGA Modules

Embedded - Microcontroller, Microprocessor, FPGA Modules

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Image Part Number Manufacturer Description Series Operating Temperature Manufacturer Part Number Size / Dimension Module/Board Type Operating System Core Processor Connector Type Reverse Recovery Time (trr)
TE0714-02-50-2I Trenz Electronic SOM ARTIX-7 XC7A50T-2I 1GB DDR3 TE0714 -40°C ~ 85°C - 1.57" x 1.18" (40mm x 30mm) FPGA Core - Artix-7 A50T Samtec LSHM -
5CSE-H4-3YA-RI Critical Link MITYSOM-5CSE W/ ALTERA CYCLONE V MitySOM -40°C ~ 85°C - 3.2" x 1.5" (82mm x 39mm) MPU, FPGA Core - ARM® Cortex®-A9, Cyclone V SX/SE Edge Connector -
EZ80F915050MODG Zilog MODULE EZ80F91 512K 50MHZ eZ80® Acclaim!® 0°C ~ 70°C - 2.5" x 3.1" (63.5mm x 78.7mm) MCU, Ethernet Core - eZ80F91 Header 2x30 -
TE0714-02-35-2I Trenz Electronic SOM ARTIX7 XC7A35T-2CSG325I 2I TE0714 -40°C ~ 85°C - 1.57" x 1.18" (40mm x 30mm) FPGA Core - Artix-7 A35T Samtec LSHM -
CC-9C-V226-ZA-B Digi International MODULE 9C 32MB SDRAM 64MB FLASH ConnectCore® -40°C ~ 85°C - 3.59" x 2.06" (91.2mm x 52.2mm) MPU Core - ARM926EJ-S, NS9360 SO-DIMM-144 -
CC-9C-V226-Z1 Digi International MODULE 9C 32MB SDRAM 64MB FLASH ConnectCore® -40°C ~ 85°C - 3.59" x 2.06" (91.2mm x 52.2mm) MPU Core - ARM926EJ-S, NS9360 SO-DIMM-144 -
FS-662 Digi International MODULE A9M2440 32MB SDRAM FLASH - - - - - - - - -
DC-ME-01T-NS-1 Digi International MODULE ME 8MB SDRAM 2MB FLASH Digi Connect ME® -40°C ~ 85°C - 1.45" x 0.75" (36.7mm x 19.1mm) MPU Core - ARM7TDMI, NS7520 RJ45 -
3358-IX-X3A-RI Critical Link MITYSOM-3358 W/ AM3358 MitySOM -40°C ~ 85°C - 2.66" x 1.5" (67.6mm x 38.1mm) MPU Core - ARM® Cortex®-A8, AM3358 SO-DIMM-204 -
TE0725LP-01-100-2D Trenz Electronic SOM ARTIX-7 XC7A100T-2C FLASH TE0725 - - 2.87" x 1.38" (73mm x 35mm) FPGA Core - Artix-7 A100T 50 Pin -

About Embedded - Microcontroller, Microprocessor, FPGA Modules


These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.