Embedded - Microcontroller, Microprocessor, FPGA Modules

Embedded - Microcontroller, Microprocessor, FPGA Modules

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Image Part Number Manufacturer Description Series Operating Temperature Manufacturer Part Number Size / Dimension Module/Board Type Operating System Core Processor Connector Type Reverse Recovery Time (trr)
DLP-245SY-G DLP Design, Inc. MODULE USB-MCU FT245RL W/SX48 USB - - 2.24" x 0.9" (56.9mm x 22.9mm) MCU, USB Core - SX48 USB - B, Pin Header -
CC-9P-V502-C-B Digi International MOD 9P 8MB SDRAM 4MB FLASH 25PAK ConnectCore® -40°C ~ 85°C - 1.97" x 1.97" (50mm x 50mm) MPU Core - ARM926EJ-S, NS9215 Board-to-Board (BTB) Socket - 160 -
DC-ME4-01T-VTY Digi International MODULE DIGI CONNECT ME Digi Connect ME® -40°C ~ 85°C - 1.45" x 0.75" (36.7mm x 19.1mm) MPU Core - ARM7TDMI, NS7520 RJ45 -
CC-MX-MB69-ZK-B Digi International MODULE I.MX51 512MB FLASH 25PK ConnectCore® - - - - - - - -
DC-ME4-01T-S-50 Digi International MOD ME 8MB SDRAM 4MB FLSH 50 PCK Digi Connect ME® -40°C ~ 85°C - 1.45" x 0.75" (36.7mm x 19.1mm) MPU Core - ARM7TDMI, NS7520 RJ45 -
TE0726-03-07S-1C Trenz Electronic SBC ZYNQBERRY Z-7007S HDMI USB E TE0726 0°C ~ 70°C - 1.57" x 1.18" (40mm x 30mm) MCU, FPGA - ARM Cortex-A9 CSI, DSI -
DC-ME-01T-VCY-1 Digi International MODULE DIGI CONNECT ME - - - - - - - - -
DC-ME-01T-NS-50 Digi International MODULE - - - - - - - - -
TE0600-03IN Trenz Electronic SOM GIGABEE 2X128MB REV. 3 TE0600 -40°C ~ 85°C - 1.97" x 1.57" (50mm x 40mm) FPGA Core - Spartan-6 LX-45 Samtec LSHM -
20-101-1247 Digi International CORE MODULE RCM5450W RabbitCore® -30°C ~ 75°C - 1.84" x 2.85" (47mm x 72mm) MPU Core - Rabbit 5000 IDC Header 2x25, 2x5, 1xAntenna -

About Embedded - Microcontroller, Microprocessor, FPGA Modules


These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.