| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Manufacturer Part Number | Size / Dimension | Module/Board Type | Operating System | Core Processor | Connector Type | Reverse Recovery Time (trr) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| DLP-245SY-G | DLP Design, Inc. | MODULE USB-MCU FT245RL W/SX48 | USB | - | - | 2.24" x 0.9" (56.9mm x 22.9mm) | MCU, USB Core | - | SX48 | USB - B, Pin Header | - | |
| CC-9P-V502-C-B | Digi International | MOD 9P 8MB SDRAM 4MB FLASH 25PAK | ConnectCore® | -40°C ~ 85°C | - | 1.97" x 1.97" (50mm x 50mm) | MPU Core | - | ARM926EJ-S, NS9215 | Board-to-Board (BTB) Socket - 160 | - | |
| DC-ME4-01T-VTY | Digi International | MODULE DIGI CONNECT ME | Digi Connect ME® | -40°C ~ 85°C | - | 1.45" x 0.75" (36.7mm x 19.1mm) | MPU Core | - | ARM7TDMI, NS7520 | RJ45 | - | |
| CC-MX-MB69-ZK-B | Digi International | MODULE I.MX51 512MB FLASH 25PK | ConnectCore® | - | - | - | - | - | - | - | - | |
| DC-ME4-01T-S-50 | Digi International | MOD ME 8MB SDRAM 4MB FLSH 50 PCK | Digi Connect ME® | -40°C ~ 85°C | - | 1.45" x 0.75" (36.7mm x 19.1mm) | MPU Core | - | ARM7TDMI, NS7520 | RJ45 | - | |
| TE0726-03-07S-1C | Trenz Electronic | SBC ZYNQBERRY Z-7007S HDMI USB E | TE0726 | 0°C ~ 70°C | - | 1.57" x 1.18" (40mm x 30mm) | MCU, FPGA | - | ARM Cortex-A9 | CSI, DSI | - | |
| DC-ME-01T-VCY-1 | Digi International | MODULE DIGI CONNECT ME | - | - | - | - | - | - | - | - | - | |
| DC-ME-01T-NS-50 | Digi International | MODULE | - | - | - | - | - | - | - | - | - | |
| TE0600-03IN | Trenz Electronic | SOM GIGABEE 2X128MB REV. 3 | TE0600 | -40°C ~ 85°C | - | 1.97" x 1.57" (50mm x 40mm) | FPGA Core | - | Spartan-6 LX-45 | Samtec LSHM | - | |
| 20-101-1247 | Digi International | CORE MODULE RCM5450W | RabbitCore® | -30°C ~ 75°C | - | 1.84" x 2.85" (47mm x 72mm) | MPU Core | - | Rabbit 5000 | IDC Header 2x25, 2x5, 1xAntenna | - |
These modules integrate microcontroller, microprocessor, or FPGA (Field-Programmable Gate Array) components into a single package or module. They offer flexibility and versatility in embedded system design, allowing developers to choose the processing architecture and capabilities that best suit their application requirements. These modules are often used in applications where off-the-shelf solutions are preferred over custom-designed circuitry, enabling faster development cycles and reducing time-to-market.