Capital Advanced Technologies, Inc., established in 1996 and headquartered in Austin, Texas, USA, is a leading provider of advanced semiconductor packaging and assembly solutions. With over two decades of experience, Capital Advanced Technologies specializes in offering turnkey solutions for the assembly and testing of integrated circuits and microelectronics devices. Their state-of-the-art facilities and cutting-edge technology enable them to meet the diverse needs of customers in industries such as aerospace, automotive, and telecommunications. Trusted for their expertise and reliability, Capital Advanced Technologies continues to drive innovation in semiconductor packaging, helping customers bring their products to market efficiently and cost-effectively.
