| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | RoHS Status | Type | Length | Shape | Material | Width | Plating - Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 7-19PCI-NI-14.40 | Leader Tech Inc. | 0.067 X 0.177 NI 14.40--7-19PCI- | - | -55°C ~ 121°C | - | Fingerstock | 14.400" (365.76mm) | - | Beryllium Copper | 1.800" (45.72mm) | Flash | |
| 67BCG2003201508R00 | Laird Technologies | SP,CON,C,AU,TNR | - | - | - | - | 0.126" (3.20mm) | - | - | 0.078" (2.00mm) | - | |
| 4242PA51H00047 | Laird Technologies | GK NICU PTAFG PU V0 DSH | - | - | - | Fabric Over Foam | 0.470" (11.94mm) | D-Shape | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | 0.252" (6.40mm) | - | |
| 3023502 | Wurth Electronics | WE-LT CONDUCTIVE SHIELDING GASKE | WE-LT | -40°C ~ 85°C | - | Fabric Over Foam | 39.370" (1.00m) | Rectangle | Polyurethane Foam, Rayon Paper | 1.378" (35.00mm) | - | |
| 6000-0225-72 | Leader Tech Inc. | 2.25" X 50" LONG TECHMESH TAPE-- | - | - | - | Gasket Sleeve | - | - | - | 2.250" (57.15mm) | - | |
| 8863-0202-72 | Laird Technologies | OSTRSD,CUSTMATL 9.5MM | - | - | - | - | - | - | - | - | - | |
| 4A66PA51H01200 | Laird Technologies | GK NICU PTAFG PU V0 BELL | 51H | -40°C ~ 70°C | - | Fabric Over Foam | 12.000" (304.80mm) | - | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | |
| S7181-45R | Harwin | RFI SHIELD FINGER AU 4.5MM SMD | EZ BoardWare | -20°C ~ 70°C | - | Shield Finger | 0.181" (4.60mm) | - | Phosphor Bronze | 0.091" (2.30mm) | Flash | |
| 4701PA51H01200 | Laird Technologies | GK NICU PTAFG PU V0 REC | - | - | - | Fabric Over Foam | 12.000" (304.80mm) | Rectangle | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | 0.374" (9.50mm) | - | |
| 3-S-23T-SN-24-NTP | Leader Tech Inc. | 0.03 X 0.23 SN 24 NTP--3-S-23T-S | - | -55°C ~ 121°C | - | Fingerstock | 24.000" (609.60mm) | - | Beryllium Copper | 0.230" (5.84mm) | Flash |
RFI (Radio-Frequency Interference) and EMI (Electromagnetic Interference) contacts, fingerstock, and gaskets are components used to provide electromagnetic shielding and grounding in electronic enclosures and systems. They help prevent the ingress and egress of unwanted electromagnetic radiation, minimizing interference and noise that can affect the performance of sensitive electronic circuits. RFI and EMI shielding components include conductive contacts, fingerstock strips, gaskets, and shielding materials made from materials such as conductive elastomers, metal alloys, and conductive foams. They are essential for maintaining electromagnetic compatibility (EMC) and ensuring compliance with regulatory standards in electronic products and systems.