RFI and EMI - Contacts, Fingerstock and Gaskets

RFI and EMI - Contacts, Fingerstock and Gaskets

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Manufacturer
Series
Operating Temperature
RoHS Status
Type
Length
Shape
Material
Width
Plating - Thickness

Clear


Image Part Number Manufacturer Description Series Operating Temperature RoHS Status Type Length Shape Material Width Plating - Thickness
4387AB51K00200 Laird Technologies GK NICU NRS PU V0 BELL - - - Fabric Over Foam 2.000" (50.80mm) Bell Polyurethane Foam, Nickel-Copper Polyester (NI/CU) 0.673" (17.10mm) -
4268AB51K00300 Laird Technologies GK NICU NRS PU V0 REC - - - Fabric Over Foam 3.000" (76.20mm) Rectangle Polyurethane Foam, Nickel-Copper Polyester (NI/CU) 0.161" (4.10mm) -
6-S-34T-BD-24 Leader Tech Inc. 0.07 X 0.34 BD 24--6-S-34T-BD-24 - -55°C ~ 121°C - Fingerstock 24.000" (609.60mm) - Beryllium Copper 0.340" (8.64mm) -
3020601 Wurth Electronics GASKET FABRIC/FOAM 6MMX1M RECT WE-LT -40°C ~ 85°C - Fabric Over Foam 39.370" (1.00m) Rectangle Polyurethane Foam, Rayon Paper 0.236" (6.00mm) -
4W00AB51G01800 Laird Technologies GK,NICU,NRSG,PU,V0,TRI 51G -40°C ~ 70°C - Fabric Over Foam 18.000" (457.20mm) - Polyurethane Foam, Nylon - -
25-109C-130-SN-16 Leader Tech Inc. 0.25 X 1.09 X 130 SN 16--25-109C - -55°C ~ 121°C - Fingerstock 16.000" (406.40mm) - Beryllium Copper 1.090" (27.69mm) Flash
10-30C-070-BD-16 Leader Tech Inc. 0.10 X 0.30 X 070 BD 16--10-30C- TechMESH -55°C ~ 121°C - Fingerstock 16.000" (406.40mm) - Beryllium Copper 0.300" (7.62mm) -
67B3G3006010010R0C Laird Technologies SP,CON,AU,TNR 10X3X6MM - - - - - - - - -
0097095432 Laird Technologies S3,STR,BF - 121°C - Fingerstock 15.000" (381.00mm) - Beryllium Copper 0.450" (11.43mm) -
4201AA51K01465 Laird Technologies GK NICU NRS PU V0 RND - - - Fabric Over Foam 14.650" (372.11mm) Round Polyurethane Foam, Nickel-Copper Polyester (NI/CU) 0.098" (2.50mm) -

About RFI and EMI - Contacts, Fingerstock and Gaskets


RFI (Radio-Frequency Interference) and EMI (Electromagnetic Interference) contacts, fingerstock, and gaskets are components used to provide electromagnetic shielding and grounding in electronic enclosures and systems. They help prevent the ingress and egress of unwanted electromagnetic radiation, minimizing interference and noise that can affect the performance of sensitive electronic circuits. RFI and EMI shielding components include conductive contacts, fingerstock strips, gaskets, and shielding materials made from materials such as conductive elastomers, metal alloys, and conductive foams. They are essential for maintaining electromagnetic compatibility (EMC) and ensuring compliance with regulatory standards in electronic products and systems.