| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | RoHS Status | Type | Length | Shape | Material | Width | Plating - Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 3-23UT-070-SN-16 | Leader Tech Inc. | 0.03 X 0.15 X 070 SN 16--TWIST C | - | -55°C ~ 121°C | - | Fingerstock | 16.000" (406.40mm) | - | Beryllium Copper | 0.230" (5.84mm) | Flash | |
| 9-78D-A-NI-16 | Leader Tech Inc. | 0.09 X 0.78 NI 16--9-78D-A-NI-16 | - | -55°C ~ 121°C | - | Fingerstock | 16.000" (406.40mm) | - | Beryllium Copper | 0.780" (19.81mm) | Flash | |
| 4609AB51G05000 | Laird Technologies | GK,NICU,NRSG,PU,V0,DSH .180X.400 | - | - | - | - | - | - | - | - | - | |
| 0097053717 | Laird Technologies | GASKET BECU 28.7X304.8MM | - | 121°C | - | Fingerstock | 12.000" (304.80mm) | - | Beryllium Copper | 1.130" (28.70mm) | 299.21µin (7.60µm) | |
| 4609PA51G00125 | Laird Technologies | GK NICU NRSG PU V0 DSH | - | - | - | Fabric Over Foam | 1.250" (31.75mm) | D-Shape | - | 0.402" (10.20mm) | - | |
| 4B68AB51K00120 | Laird Technologies | GK NICU NRS PU V0 DSH | 51K | -40°C ~ 70°C | - | Fabric Over Foam | 1.200" (30.48mm) | - | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | |
| 19-04-22371-6502 | Parker Chomerics | CHO-SEAL 6502 NI/AL EMI 0.043" | - | -29°C ~ 66°C | - | Gasket | - | Round | Conductive Elastomer | 0.056" (1.42mm) | - | |
| SMG118118R-0.118 | Leader Tech Inc. | SURFACE MOUNT GASKET | - | - | - | Film Over Foam | 0.079" (2.00mm) | Rectangle | Polyurethane Foam, Tin-Copper Polyester (SN/CU) | 0.118" (3.00mm) | - | |
| 8863-0110-72 | Laird Technologies | EMI | - | - | - | Gasket | - | Round | - | 0.067" (1.70mm) | - | |
| 4049PA51G01200 | Laird Technologies | GASKET FAB/FOAM 6.35X304.8MM SQ | - | - | - | Fabric Over Foam | 12.000" (304.80mm) | Square | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | 0.252" (6.40mm) | - |
RFI (Radio-Frequency Interference) and EMI (Electromagnetic Interference) contacts, fingerstock, and gaskets are components used to provide electromagnetic shielding and grounding in electronic enclosures and systems. They help prevent the ingress and egress of unwanted electromagnetic radiation, minimizing interference and noise that can affect the performance of sensitive electronic circuits. RFI and EMI shielding components include conductive contacts, fingerstock strips, gaskets, and shielding materials made from materials such as conductive elastomers, metal alloys, and conductive foams. They are essential for maintaining electromagnetic compatibility (EMC) and ensuring compliance with regulatory standards in electronic products and systems.