RFI and EMI - Contacts, Fingerstock and Gaskets

RFI and EMI - Contacts, Fingerstock and Gaskets

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Manufacturer
Series
Operating Temperature
RoHS Status
Type
Length
Shape
Material
Width
Plating - Thickness

Clear


Image Part Number Manufacturer Description Series Operating Temperature RoHS Status Type Length Shape Material Width Plating - Thickness
4742PA22101800 Laird Technologies GSKT FAB/FOAM 3.8X457.2MM DSHAPE - - - Fabric Over Foam 18.000" (457.20mm) D-Shape - 0.150" (3.80mm) -
0077004919 Laird Technologies NOSG,STR,NIB,PSA - 121°C - Fingerstock 0.347" (8.81mm) - Beryllium Copper 0.600" (15.24mm) 299.21µin (7.60µm)
0097095502 Laird Technologies FINGERSTOCK BECU 11.43X381MM - 121°C - Fingerstock 15.000" (381.00mm) - Beryllium Copper 0.450" (11.43mm) -
19-04-28402-S6305 Parker Chomerics CHO-SEAL S6305 NI/C EMI 0.065" - -29°C ~ 66°C - Gasket - Round Conductive Elastomer 0.076" (1.93mm) -
4744AD51N09600 Laird Technologies GK NICU MESHG PU V0 REC - - - Fabric Over Foam 96.000" (243.84cm) Rectangle - 0.579" (14.70mm) -
4693PA51G01800 Laird Technologies GASKET FAB/FOAM 4.8X457.2MM RECT - - - Fabric Over Foam 18.000" (457.20mm) Rectangle - 0.189" (4.80mm) -
4056AB51K09600 Laird Technologies GK NICU NRS PU V0 REC - - - Fabric Over Foam 96.000" (243.84cm) Rectangle Polyurethane Foam, Nickel-Copper Polyester (NI/CU) 0.201" (5.10mm) -
4243ABH1K01320 Laird Technologies GK NICU NRS PU V0 CSH - - - Fabric Over Foam 13.200" (335.28mm) C-Fold Polyurethane Foam, Nickel-Copper Polyester (NI/CU) 0.429" (10.90mm) -
S7221-45R Harwin RFI SHIELD FINGER AU 1.23MM SMD EZ BoardWare -20°C ~ 70°C - Shield Finger, Pre-Loaded 0.102" (2.60mm) - Copper Alloy 0.039" (1.00mm) Flash
0097054115 Laird Technologies NOSG,STR,ZNC,PSA Foldover 121°C - Fingerstock 16.000" (406.40mm) - Beryllium Copper 0.380" (9.65mm) 299.21µin (7.60µm)

About RFI and EMI - Contacts, Fingerstock and Gaskets


RFI (Radio-Frequency Interference) and EMI (Electromagnetic Interference) contacts, fingerstock, and gaskets are components used to provide electromagnetic shielding and grounding in electronic enclosures and systems. They help prevent the ingress and egress of unwanted electromagnetic radiation, minimizing interference and noise that can affect the performance of sensitive electronic circuits. RFI and EMI shielding components include conductive contacts, fingerstock strips, gaskets, and shielding materials made from materials such as conductive elastomers, metal alloys, and conductive foams. They are essential for maintaining electromagnetic compatibility (EMC) and ensuring compliance with regulatory standards in electronic products and systems.