| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | RoHS Status | Type | Length | Shape | Material | Width | Plating - Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 4203AB51K00100 | Laird Technologies | GK NICU NRS PU V0 REC | - | - | - | Fabric Over Foam | 1.000" (25.40mm) | Rectangle | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | 0.098" (2.50mm) | - | |
| 37-131-1011-02400 | Parker Chomerics | SOFT SHIELD 3700 EMI 1011 24" | - | -40°C ~ 125°C | - | Fabric Over Foam | 24.000" (609.60mm) | Rectangle | Nickel-Copper Polyester (NI/CU) | 0.197" (5.00mm) | - | |
| 0077006802 | Laird Technologies | GASKET BECU 7.57X406.4MM | Slot Mount | - | - | - | 16.000" (406.40mm) | - | - | 0.298" (7.57mm) | - | |
| 3030202 | Wurth Electronics | GASKET FABRIC/FOAM 2MMX1M DSHAPE | WE-LT | -40°C ~ 85°C | - | Fabric Over Foam | 39.370" (1.00m) | D-Shape | Polyurethane Foam, Rayon Paper | 0.079" (2.00mm) | - | |
| 4184PA22101800 | Laird Technologies | GSKT FAB/FOAM 3.8X457.2MM DSHAPE | - | - | - | Fabric Over Foam | 18.000" (457.20mm) | D-Shape | - | 0.150" (3.80mm) | - | |
| 25-109FSDS-BD-24 | Leader Tech Inc. | 0.25 X 1.09 BD 24--FOLDED SERIES | - | -55°C ~ 121°C | - | Fingerstock | 24.000" (609.60mm) | - | Beryllium Copper | 1.090" (27.69mm) | - | |
| 4584PA51G00965 | Laird Technologies | GK NICU NRSG PU V0 DSH | - | - | - | Fabric Over Foam | 9.650" (245.11mm) | D-Shape | - | 0.150" (3.80mm) | - | |
| 0561001000 | Laird Technologies | S3,STR,BF,USFT,PSA,CTL .110X.350 | - | - | - | - | - | - | - | - | - | |
| 0097013721 | Laird Technologies | CSTR,STR,SU | Foldover | 121°C | - | Fingerstock | - | - | Beryllium Copper | - | - | |
| 19-04-14206-S6305 | Parker Chomerics | CHO-SEAL S6305 NI/C EMI 0.080" | - | -29°C ~ 66°C | - | Gasket | - | Round | Conductive Elastomer | 0.080" (2.03mm) | - |
RFI (Radio-Frequency Interference) and EMI (Electromagnetic Interference) contacts, fingerstock, and gaskets are components used to provide electromagnetic shielding and grounding in electronic enclosures and systems. They help prevent the ingress and egress of unwanted electromagnetic radiation, minimizing interference and noise that can affect the performance of sensitive electronic circuits. RFI and EMI shielding components include conductive contacts, fingerstock strips, gaskets, and shielding materials made from materials such as conductive elastomers, metal alloys, and conductive foams. They are essential for maintaining electromagnetic compatibility (EMC) and ensuring compliance with regulatory standards in electronic products and systems.