| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | RoHS Status | Type | Length | Shape | Material | Width | Plating - Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 4096AB51K00050 | Laird Technologies | GK NICU NRS PU V0 REC | - | - | - | Fabric Over Foam | 0.500" (12.70mm) | Rectangle | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | 0.276" (7.00mm) | - | |
| 4787PA51H00045 | Laird Technologies | GK NICU PTAFG PU V0 DSH | - | - | - | Fabric Over Foam | 0.450" (11.43mm) | D-Shape | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | 0.252" (6.40mm) | - | |
| 1775073-1 | Agastat Relays / TE Connectivity | SHIELD FINGER 434025N7 | - | - | - | Shield Finger, Pre-Loaded | 0.138" (3.50mm) | - | Copper Alloy | 0.098" (2.50mm) | 2µin (0.05µm) | |
| 4850-12-1212-0500 | Parker Chomerics | SOFT SHIELD 4850 12"X12" 5MM | - | -40°C ~ 70°C | - | Fabric Over Foam | 12.000" (304.80mm) | Square | Copper | 12.000" (304.80mm) | - | |
| 1054390002 | Affinity Medical Technologies - a Molex company | CLIP SPRING ASSY 1.42MM | - | - | - | Shield Finger, Pre-Loaded | 0.090" (2.28mm) | - | Stainless Steel | 0.059" (1.50mm) | 49.213µin (1.25µm) | |
| 0097011721 | Laird Technologies | CSTR,STR,SU | Foldover | 121°C | - | Fingerstock | - | - | Beryllium Copper | - | - | |
| 0078001818 | Laird Technologies | SLMT,3F,NIE,USFT | Slot Mount | 121°C | - | Fingerstock | 0.543" (13.79mm) | - | Beryllium Copper | 0.320" (8.13mm) | 299.21µin (7.60µm) | |
| 0097200400 | Laird Technologies | FINGERSTOCK BECU | Foldover | 121°C | - | Fingerstock | - | - | Beryllium Copper | - | - | |
| 0097052016 | Laird Technologies | AP,STR,ZNY,PSA .140X.370X.250X16 | - | - | - | - | - | - | - | - | - | |
| 4212PA51G02800 | Laird Technologies | GK NICU NRSG PU V0 SQ | - | - | - | Fabric Over Foam | 28.000" (711.20mm) | Square | - | 0.197" (5.00mm) | - |
RFI (Radio-Frequency Interference) and EMI (Electromagnetic Interference) contacts, fingerstock, and gaskets are components used to provide electromagnetic shielding and grounding in electronic enclosures and systems. They help prevent the ingress and egress of unwanted electromagnetic radiation, minimizing interference and noise that can affect the performance of sensitive electronic circuits. RFI and EMI shielding components include conductive contacts, fingerstock strips, gaskets, and shielding materials made from materials such as conductive elastomers, metal alloys, and conductive foams. They are essential for maintaining electromagnetic compatibility (EMC) and ensuring compliance with regulatory standards in electronic products and systems.