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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Mounting Type | Housing Material | Termination | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 511-13-124-14-071002 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 18-6503-20 | Aries Electronics, Inc. | CONN IC DIP SOCKET 18POS GOLD | 503 | -55°C ~ 105°C | Closed Frame | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Wire Wrap | - | - | |
| 116-91-652-41-008000 | Mill-Max | CONN IC SKT DBL | - | - | - | - | - | - | - | - | - | |
| 522-13-181-17-001001 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - | |
| 20-3508-211 | Aries Electronics, Inc. | CONN IC DIP SOCKET 20POS GOLD | 508 | -55°C ~ 125°C | Open Frame | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Wire Wrap | - | - | |
| 30-0508-30 | Aries Electronics, Inc. | CONN SOCKET SIP 30POS GOLD | 508 | -55°C ~ 125°C | - | 3A | Through Hole | Polyamide (PA46), Nylon 4/6 | Wire Wrap | - | - | |
| 44-3552-16 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 44POS | 55 | - | Closed Frame | 1A | Through Hole | Polyphenylene Sulfide (PPS), Glass Filled | Solder | - | - | |
| 05-0513-10H | Aries Electronics, Inc. | CONN SOCKET SIP 5POS GOLD | 0513 | - | - | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Solder | - | - | |
| 116-93-952-61-001000 | Mill-Max | CONN IC SKT DBL | - | - | - | - | - | - | - | - | - | |
| 523-93-256-19-081001 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.