20-3508-211

Invent, Innovate, Integrate

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Part Number	20-3508-211
Manufacturer	Aries Electronics, Inc.
Description	CONN IC DIP SOCKET 20POS GOLD
Category	Connectors, Interconnects
Subcategory	Sockets for ICs, Transistors
Type	DIP, 0.3" (7.62mm) Row Spacing
Series	508
Features	Open Frame
Packaging	Bulk
Pitch Post	0.100" (2.54mm)
Pitch Mating	0.100" (2.54mm)
Termination	Wire Wrap
Mounting Type	Through Hole
Current Rating	3A
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish Post	Gold
Contact Finish Mating	Gold
Contact Material Post	Brass
Operating Temperature	-55°C ~ 125°C
Contact Material Mating	Beryllium Copper
Termination Post Length	0.500" (12.70mm)
Lead Free Status Ro H S Status	Lead free / RoHS Compliant
Contact Finish Thickness Post	10.0µin (0.25µm)
Material Flammability Rating	UL94 V-0
Moisture Sensitivity Level M S L	1 (Unlimited)
Numberof Positionsor Pins Grid	20 (2 x 10)
Contact Finish Thickness Mating	30.0µin (0.76µm)

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