DS34S132GN
Images are for reference only. See Product Specifications for product details.
Invent, Innovate, Integrate
Images are for reference only. See Product Specifications for product details.
| Part Number | DS34S132GN |
| Manufacturer | Maxim Integrated |
| Description | IC TDM/PACKET TRANSPORT 676BGA |
| Datasheet | View Datasheet |
| Category | Integrated Circuits (ICs) |
| Subcategory | Interface - Telecom |
| Function | TDM-over-Packet (TDMoP) |
| Interface | TDMoP |
| Packaging | Tray |
| Package Case | 676-BGA |
| Mounting Type | Surface Mount |
| Voltage Supply | 1.8V, 3.3V |
| Base Part Number | DS34S132 |
| Numberof Circuits | 1 |
| Detailed Description | Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27) |
| Operating Temperature | -40°C ~ 85°C |
| Supplier Device Package | 676-TEPBGA (27x27) |
| Lead Free Status Ro H S Status | Contains lead / RoHS non-compliant |
| Moisture Sensitivity Level M S L | 1 (Unlimited) |