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Product Image
DS34S132GN

Images are for reference only. See Product Specifications for product details.

Product Details

Part Number DS34S132GN
Manufacturer Maxim Integrated
Description IC TDM/PACKET TRANSPORT 676BGA
Datasheet View Datasheet
Category Integrated Circuits (ICs)
Subcategory Interface - Telecom
Function TDM-over-Packet (TDMoP)
Interface TDMoP
Packaging Tray
Package Case 676-BGA
Mounting Type Surface Mount
Voltage Supply 1.8V, 3.3V
Base Part Number DS34S132
Numberof Circuits 1
Detailed Description Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)
Operating Temperature -40°C ~ 85°C
Supplier Device Package 676-TEPBGA (27x27)
Lead Free Status Ro H S Status Contains lead / RoHS non-compliant
Moisture Sensitivity Level M S L 1 (Unlimited)

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