• info@zenkaeurope.com
  • English
    English
    Deutsch
    Français
    Español
    Italiano
    中文
    हिन्दी
    Lietuviškai
Product Image
EPC2023ENG

Images are for reference only. See Product Specifications for product details.

Product Details

Part Number EPC2023ENG
Manufacturer EPC
Description TRANS GAN 30V 60A BUMPED DIE
Category Discrete Semiconductor Products
Subcategory Transistors - FETs, MOSFETs - Single
Series eGaN®
Vgs Max +6V, -4V
F E T Type N-Channel
Packaging Tray
Other Names 917-EPC2023ENG EPC2023ENGRC2
Technology GaNFET (Gallium Nitride)
Vgsth Max Id 2.5V @ 20mA
Package Case Die
Mounting Type Surface Mount
Rds On Max Id Vgs 1.3 mOhm @ 40A, 5V
Gate Charge Qg Max Vgs 20nC @ 5V
Detailed Description 327384
Operating Temperature -40°C ~ 150°C (TJ)
Supplier Device Package Die
Drainto Source Voltage Vdss 30V
Lead Free Status Ro H S Status Lead free / RoHS Compliant
Input Capacitance Ciss Max Vds 2300pF @ 15V
Current Continuous Drain Id25 C 60A (Ta)
Moisture Sensitivity Level M S L 1 (Unlimited)
Drive Voltage Max Rds On Min Rds On 5V

REQUEST A QUOTE


Contact Us

We're here round-the-clock for inquiries, partnership opportunities, or any assistance you need.

Contact Us