EPC2010CENGR
Images are for reference only. See Product Specifications for product details.
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Images are for reference only. See Product Specifications for product details.
| Part Number | EPC2010CENGR |
| Manufacturer | EPC |
| Description | TRANS GAN 200V 22A BUMPED DIE |
| Category | Discrete Semiconductor Products |
| Subcategory | Transistors - FETs, MOSFETs - Single |
| Series | eGaN® |
| F E T Feature | N-Channel |
| Other Names | 917-EPC2010CENGRTR |
| Ro H S Status | Tape & Reel (TR) |
| Technology | GaNFET (Gallium Nitride) |
| Vgsth Max Id | 25 mOhm @ 12A, 5V |
| Voltage Test | 380pF @ 100V |
| Mounting Type | Surface Mount |
| Polarization | Die |
| Rds On Max Id Vgs | 22A (Ta) |
| Voltage Breakdown | Die Outline (7-Solder Bar) |
| Gate Charge Qg Max Vgs | 2.5V @ 3mA |
| Expanded Description | N-Channel 200V 22A (Ta) Surface Mount Die Outline (7-Solder Bar) |
| Operating Temperature | -40°C ~ 150°C (TJ) |
| Manufacturer Part Number | EPC2010CENGR |
| Lead Free Status Ro H S Status | Lead free / RoHS Compliant |
| Input Capacitance Ciss Max Vds | 3.7nC @ 5V |
| Current Continuous Drain Id25 C | 200V |
| Moisture Sensitivity Level M S L | 1 (Unlimited) |