XR2D-4001-N

Invent, Innovate, Integrate

Images are for reference only. See Product Specifications for product details.

Part Number	XR2D-4001-N
Manufacturer	Omron
Description	CONN IC DIP SOCKET 40POS GOLD
Category	Connectors, Interconnects
Subcategory	Sockets for ICs, Transistors
Type	DIP, 0.6" (15.24mm) Row Spacing
Series	XR2
Features	Carrier
Packaging	Bulk
Pitch Post	0.100" (2.54mm)
Other Names	XR2D4001N
Pitch Mating	0.100" (2.54mm)
Termination	Solder
Mounting Type	Through Hole
Current Rating	1A
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Contact Finish Post	Gold
Contact Resistance	20 mOhm
Contact Finish Mating	Gold
Contact Material Post	Beryllium Copper
Operating Temperature	-55°C ~ 125°C
Contact Material Mating	Beryllium Copper
Lead Free Status Ro H S Status	Lead free / RoHS Compliant
Contact Finish Thickness Post	29.5µin (0.75µm)
Material Flammability Rating	UL94 V-0
Moisture Sensitivity Level M S L	1 (Unlimited)
Numberof Positionsor Pins Grid	40 (2 x 20)
Contact Finish Thickness Mating	29.5µin (0.75µm)

Loading security check...

Please verify you are human by completing the security check.