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Product Image
DILB20P-223TLF

Images are for reference only. See Product Specifications for product details.

Product Details

Part Number DILB20P-223TLF
Manufacturer Amphenol FCI
Description CONN IC DIP SOCKET 20POS TIN
Category Connectors, Interconnects
Subcategory Sockets for ICs, Transistors
Type DIP, 0.3" (7.62mm) Row Spacing
Features Open Frame
Packaging Tube
Pitch Post 0.100" (2.54mm)
Other Names 609-4714
Pitch Mating 0.100" (2.54mm)
Termination Solder
Mounting Type Through Hole
Current Rating 1A
Housing Material Polyamide (PA), Nylon
Contact Finish Post Tin
Contact Resistance 30 mOhm
Contact Finish Mating Tin
Contact Material Post Copper Alloy
Operating Temperature -55°C ~ 105°C
Contact Material Mating Copper Alloy
Termination Post Length 0.124" (3.15mm)
Lead Free Status Ro H S Status Lead free / RoHS Compliant
Contact Finish Thickness Post 100.0µin (2.54µm)
Material Flammability Rating UL94 V-0
Moisture Sensitivity Level M S L 1 (Unlimited)
Numberof Positionsor Pins Grid 20 (2 x 10)
Contact Finish Thickness Mating 100.0µin (2.54µm)

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