BU200Z-178-HT

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Part Number	BU200Z-178-HT
Manufacturer	On-Shore Technology, Inc.
Description	CONN IC DIP SOCKET 20POS GOLD
Category	Connectors, Interconnects
Subcategory	Sockets for ICs, Transistors
Type	DIP, 0.3" (7.62mm) Row Spacing
Series	BU-178HT
Features	Open Frame
Packaging	Tube
Pitch Post	0.100" (2.54mm)
Other Names	BU200Z178HT ED2206
Pitch Mating	0.100" (2.54mm)
Termination	Solder
Mounting Type	Surface Mount
Current Rating	1A
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Contact Finish Post	Copper
Contact Resistance	7 mOhm
Contact Finish Mating	Gold
Contact Material Post	Brass
Operating Temperature	-55°C ~ 125°C
Contact Material Mating	Beryllium Copper
Termination Post Length	0.059" (1.50mm)
Lead Free Status Ro H S Status	Lead free / RoHS Compliant
Contact Finish Thickness Post	Flash
Material Flammability Rating	UL94 V-0
Moisture Sensitivity Level M S L	1 (Unlimited)
Numberof Positionsor Pins Grid	20 (2 x 10)
Contact Finish Thickness Mating	78.7µin (2.00µm)

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