BU180Z-178-HT

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Part Number	BU180Z-178-HT
Manufacturer	On-Shore Technology, Inc.
Description	CONN IC DIP SOCKET 18POS GOLD
Datasheet	View Datasheet
Category	Connectors, Interconnects
Subcategory	Sockets for ICs, Transistors
Type	DIP, 0.3" (7.62mm) Row Spacing
Series	BU-178HT
Features	Open Frame
Packaging	Tube
Pitch Post	0.100" (2.54mm)
Other Names	BU180Z-178HT BU180Z178HT ED2205
Pitch Mating	0.100" (2.54mm)
Termination	Solder
Mounting Type	Surface Mount
Current Rating	1A
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Contact Finish Post	Copper
Contact Resistance	7 mOhm
Contact Finish Mating	Gold
Contact Material Post	Brass
Operating Temperature	-55°C ~ 125°C
Contact Material Mating	Beryllium Copper
Termination Post Length	0.059" (1.50mm)
Lead Free Status Ro H S Status	Lead free / RoHS Compliant
Contact Finish Thickness Post	Flash
Material Flammability Rating	UL94 V-0
Moisture Sensitivity Level M S L	1 (Unlimited)
Numberof Positionsor Pins Grid	18 (2 x 9)
Contact Finish Thickness Mating	78.7µin (2.00µm)

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