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Manufacturer Image
558-10-256M16-000101

Images are for reference only. See Product Specifications for product details.

Product Details

Part Number 558-10-256M16-000101
Manufacturer Preci-Dip
Description PGA SOLDER TAIL 1.27MM
Category Connectors, Interconnects
Subcategory Sockets for ICs, Transistors
Type PGA
Series 558
Features Closed Frame
Packaging Bulk
Pitch Post 0.050" (1.27mm)
Pitch Mating 0.050" (1.27mm)
Termination Solder
Mounting Type Through Hole
Current Rating 1A
Housing Material FR4 Epoxy Glass
Contact Finish Post Gold
Contact Resistance 10 mOhm
Contact Finish Mating Gold
Contact Material Post Brass
Operating Temperature -55°C ~ 125°C
Contact Material Mating Beryllium Copper
Termination Post Length 0.111" (2.83mm)
Lead Free Status Ro H S Status Lead free / RoHS Compliant
Contact Finish Thickness Post 10.0µin (0.25µm)
Material Flammability Rating UL94 V-0
Moisture Sensitivity Level M S L 1 (Unlimited)
Numberof Positionsor Pins Grid 256 (16 x 16)
Contact Finish Thickness Mating 10.0µin (0.25µm)

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